Abstract: A method for thermal driven placement begins by first computing thermal response functions for individual components for several locations on a placement surface as a preprocessing step to placement. The thermal response functions can then be used to compute junction temperatures of components quickly and accurately during placement of the components in a layout. For a given component location, the component's junction temperature is computed by summing the contributions of neighboring components with the component's own contribution. The difference between predefined junction temperatures for the components and the calculated junction temperatures can then be used to assess the merits of the placement.

Abstract: A computer-assisted method for routing breakouts includes finding a matching for a group of pins and vias, and then routing paths between matching pin-via pairs. The matching is computed efficiently and quickly by creating convex hull data structures to represent the pins and vias, and then computing a common tangent from these convex hull structures. The endpoints of the common tangent comprise matching pin-via pairs. A matching pair is routed to find a path between a pin and via pair that achieves predefined design constraints. The method can be extended to routing wire bond connections as well.