Patents by Inventor Robert Markunas

Robert Markunas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer bonding hermetic encapsulation
    Patent number: 7622324
    Abstract: A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: November 24, 2009
    Assignee: Ziptronix
    Inventors: Paul M. Enquist, Qin-Yi Tong, Gaius Gillman Fountain, Jr., Robert Markunas
  • Wafer bonding hermetic encapsulation
    Publication number: 20050009246
    Abstract: A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device.
    Type: Application
    Filed: August 9, 2004
    Publication date: January 13, 2005
    Applicant: Ziptronix, Inc.
    Inventors: Paul Enquist, Qin-Yi Tong, Gaius Fountain, Robert Markunas
  • Wafer bonding hermetic encapsulation
    Patent number: 6822326
    Abstract: A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: November 23, 2004
    Assignee: Ziptronix
    Inventors: Paul M. Enquist, Qin-Yi Tong, Gaius Gillman Fountain, Jr., Robert Markunas
  • Wafer bonding hermetic encapsulation
    Publication number: 20040058476
    Abstract: A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for non-adhesive direct bonding, prepares a surface of a device carrier including the electronic device for non-adhesive direct bonding, and bonds the prepared surface of the encapsulating member to the prepared surface of the device carrier to form an encapsulation of the electronic device. As such, an encapsulated electronic device results which includes the device carrier having a first bonding region encompassing the electronic device, includes the encapsulating member having at least one relief preventing contact between the electronic device and the encapsulating member and having a second bonding region bonded to the first bonding region of the device carrier, and includes a non-adhesive direct bond formed between the first and second bonding regions thereby to form an encapsulation of the electronic device.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 25, 2004
    Applicant: Ziptronix
    Inventors: Paul M. Enquist, Qin-Yi Tong, Gaius Gillman Fountain, Robert Markunas