Abstract: In some examples, a system (1900) includes a hearing protector (1920); at least one position sensor; at least one sound monitoring sensor; at least one computing device configured to: receive, from the at least one sound monitoring sensor and over a time duration, indications of sound levels to which a worker is exposed; determine, from the at least one position sensor and during the time duration, that the hearing protector is not positioned at one or more ears of the worker to attenuate the sound levels; and generate, in response to the determination that at least one of the sound levels satisfies an exposure threshold during the time duration and the hearing protector is not positioned at one or more ears of the worker to attenuate the sound levels, an indication for output.

Abstract: A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.

Abstract: Disclosed are apparatuses and methods for an apparatus that has a flexible mounting substrate, one or more flexible photovoltaic modules attached to the flexible mounting substrate, one or more inverters attached to the flexible mounting substrate and electrically connected to the one or more flexible photovoltaic modules, a flexible electrical conduit electrically connected to the one or more inverters and to the one or more flexible photovoltaic modules, a plurality of mounting features, and a plurality of flexible connectors that extend between the flexible mounting substrate and one corresponding mounting feature, that is configured to be positioned above a structure and secured to the structure without penetrating roofing of the structure.

Abstract: Disclosed are apparatuses and methods for cutting thin film solar cells. The apparatus may include circular knife cutter rollers, each having a knife edge and coupled with a cutter arbor, support rollers, each coupled to a support arbor and having first and second outer surfaces and a circumferential gap between the first and second outer surfaces partially defined by a first side, a second side facing and offset from the first side, a first rounded edge where the first side intersects with the first outer surface, and a second sharp edge where the second side intersects with the second outer surface. The cutter arbor and support arbor are offset, and the knife cutter rollers and support rollers are axially spaced, such that one knife edge is positioned in the gap of each support roller and the web may be fed between the cutter arbor and the support arbor.

Abstract: A deposition system and method for depositing a uniform film of a chalcogen-containing compound semiconductor are provided. The deposition system includes a vacuum enclosure connected to a vacuum pump, a sputtering system comprising at least one sputtering target located in the vacuum enclosure, a chalcogen-containing gas source, and a gas distribution manifold having a supply side and a distribution side. The distribution side has a plurality of opening regions having independent temperature control and the supply side is connected to the chalcogen-containing gas source. A method of reactive sputter depositing a chalcogen-containing compound semiconductor material includes sputtering at least one metal component of the chalcogen-containing compound semiconductor material onto the substrate, and providing a higher chalcogen flux to ends of the substrate than to a middle of the substrate to form the chalcogen-containing compound semiconductor material.

Abstract: A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.

Abstract: The present application discloses systems and methods for generating a personal network resource map of a user based on data that has been inputted by the user regarding his or her relationships. The relationships may be categorized and displayed according to their type, e.g., family, professional, medical/healthcare, spiritual, or educational.

Abstract: A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.

Abstract: A deposition apparatus includes an input spool located in non-vacuum input module, at least one vacuum process module, an accumulator, and an air to vacuum sealing mechanism. The accumulator and the sealing mechanism are configured to continuously provide a web substrate from the input spool at atmosphere into the at least one process module at vacuum without stopping the web substrate.

Abstract: A deposition apparatus includes an input spool located in non-vacuum input module, at least one vacuum process module, an accumulator, and an air to vacuum sealing mechanism. The accumulator and the sealing mechanism are configured to continuously provide a web substrate from the input spool at atmosphere into the at least one process module at vacuum without stopping the web substrate.

Abstract: A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.

Abstract: A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.

Abstract: A method for fabricating a solar cell. The method includes providing a thin metallic substrate in roll form. The method also includes applying an abrasive grit to a surface of the thin metallic substrate. The method includes mechanical-polishing the surface with the abrasive grit such that the surface is polished to remove at least one defect from the surface. Mechanical-polishing the surface of the thin metallic substrate is by a roll-to-roll polishing process of the surface of the thin metallic substrate. Moreover, the method includes depositing an absorber layer of the solar cell on the thin metallic substrate.

Abstract: A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.

Abstract: A shielding system for a physical vapor deposition chamber having a sputter target above the pedestal. The shielding system comprises a pedestal shield attachable to the pedestal and movable therewith. The pedestal shield surrounds and extends outward from the pedestal toward the chamber side or lower walls. The system also comprises a sidewall shield adapted to extend substantially around and within the chamber sidewalls, and downward from an upper portion thereof. The sidewall shield has a lower end extending inward and disposed adjacent the pedestal shield upper portion when the pedestal is in the raised position. The pedestal shield and sidewall shield cooperate, when the pedestal is in the raised position, to prevent line-of-sight deposition transmission from the sputter target to the side and lower walls of the deposition chamber.

Abstract: A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.

Abstract: A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.

Abstract: A method for a robotic semiconductor wafer processing system to correct for wafers that have become offset or off-center during wafer processing. This is accomplished by determining the amount of offset and re-centering the wafer during wafer transport to the next process station using a single station sensor to locate the wafer center point. Each single sensor located at each station activates when the wafer's edge traverses through the sensor's path. Directional coordinates for the measured designated points on the wafer's edge are calculated, and the intersection points of two circles, analytically derived from using the measured designated points as their centers, are determined. The intersection point closest to the true wafer center position represents the measured wafer's center point. This point is compared to the true wafer center position, and the wafer is then adjusted for this difference.

Abstract: A multi-level shelf degas station relying on at least two heaters integrated within wafer holding shelves or slots, where the semiconductor wafers do not have direct contact with the heater shelves. The heaters provide conduction heating. In order to degas a wafer, the heater and wafer holder assembly is positioned in a sequential manner through each wafer slot to the next available slot. If a degassed wafer exists in the slot, a transfer chamber arm removes it. A loader arm then places a wafer in the available, empty slot and the stage is moved upwards to receive the wafer from the loader arm. The transfer chamber arm removes an individual wafer from the heater and wafer holder assembly allowing the removed wafer to be individually processed while the other wafers remain in the heater and wafer holder assembly. In some instances, a loader arm may also remove wafers.

Abstract: A failsafe engine fuel control system is disclosed in which a primary control signal, normally a direct function of an engine manifold pressure sensor signal, is utilized by an electronic engine control microprocessor to calculate control signals for engine fuel injectors and engine spark apparatus. Pressure sensor failure detection apparatus is provided which, in the event of the engine manifold pressure sensor signal being non-representive of actual engine manifold pressure, results in making the primary control signal utilized by the microprocessor a direct function of at least an analog sensor signal representative of engine throttle position rather than engine manifold pressure. Preferably, in the event of a pressure sensor failure the primary control signal is calculated as a function of both a throttle position signal and an engine speed signal.