Abstract: Method and Systems for extracting a concentrated sample of particles include priming a concentrate reservoir by passing a fluid through the concentrate reservoir to remove air. The concentrate reservoir has a first end with an opening and second end with an opening. The second end of the concentrate reservoir is closed off, and particles are accumulated within the concentrate reservoir by use of a particle concentrator. Thereafter, the first end of the concentrate reservoir is closed off, isolating the concentrate reservoir from particle concentrator, from which the particles were obtained. The second end of the concentrate reservoir is thereafter opened, and the particles of the concentrated sample in the concentrate reservoir are extracted to a sample capture reservoir through the second end opening of the concentrate reservoir.

Abstract: Method and Systems for extracting a concentrated sample of particles include priming a concentrate reservoir by passing a fluid through the concentrate reservoir to remove air. The concentrate reservoir has a first end with an opening and second end with an opening. The second end of the concentrate reservoir is closed off, and particles are accumulated within the concentrate reservoir by use of a particle concentrator. Thereafter, the first end of the concentrate reservoir is closed off, isolating the concentrate reservoir from particle concentrator, from which the particles were obtained. The second end of the concentrate reservoir is thereafter opened, and the particles of the concentrated sample in the concentrate reservoir are extracted to a sample capture reservoir through the second end opening of the concentrate reservoir.

Abstract: A beam position control system controls a position of a beam directed from a beam source. The beam position control system includes a beam position sensing system that generates one or more satellite beams which are used to determine the position of a main beam. A beam offset computation block determines a relative position of the main beam with respect to a desired main beam position and provides beam offset information to a controller that generates a compensation signal used to adjust the main beam position to the desired main beam position via a beam actuation system.

Abstract: A variable modulator assembly includes a deformable layer adhered to a compliant layer surface, and an n-phase electrode configuration, n>2, adhered to an opposite surface of the compliant layer. A controller is configured to selectively apply a variable signal to the selected electrodes of the electrode configuration. Application of the variable signal causes the deformable layer to reconfigure to an alternated shape having distinct peaks and valleys. The distance between the peaks and valleys being determined by the value of the applied variable signal, wherein the alternated shape travels in a preferred direction. An optical modulating method includes positioning the variable modulator assembly to receive and reflect light from a light source, monitoring the reflected light, and altering the variable signal to maintain a desired output intensity.

Abstract: A variable modulator assembly includes a deformable layer adhered to a compliant layer surface, and an n-phase electrode configuration, n>2, adhered to an opposite surface of the compliant layer. A controller is configured to selectively apply a variable signal to the selected electrodes of the electrode configuration. Application of the variable signal causes the deformable layer to reconfigure to an alternated shape having distinct peaks and valleys. The distance between the peaks and valleys being determined by the value of the applied variable signal, wherein the alternated shape travels in a preferred direction. An optical modulating method includes positioning the variable modulator assembly to receive and reflect light from a light source, monitoring the reflected light, and altering the variable signal to maintain a desired output intensity.

Abstract: A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of electronic devices. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A beam position control system controls a position of a beam directed from a beam source. A beam position sensing system, generates one or more satellite beams which are used to determine the position of a main beam. A beam offset computation block is configures to determine a relative position of the main beam to a desired main beam position. Beam offset information is generated by the beam offset computational block, and a controller is configured to receive the beam offset information from the beam offset computation block. A compensation signal, generated by the controller, is designed to adjust the main beam position to the desired main beam position, where a beam actuation system is configured to receive the compensation signal and adjust the main beam position.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of electronic devices. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.