Abstract: A carton including: a) a base; b) a lid having a top side and underside; c) a first side; d) a front side, wherein at least a portion of the front side is located adjacent to the first side and there is an arcuate transition between the first side and the front side; e) a second side, wherein at least a portion of the second side is located adjacent to the front side and there is an arcuate transition between the second side and the front side; and f) a back side, wherein a portion of the back side is located adjacent to the first side and a portion of the back side is located adjacent to the second side and the back side has no arcuate transitions between itself, the first side, or the second side.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Multi-die packages including both photonic and electric integrated circuit (IC) die interconnected to each other through a routing structure built-up on a glass substrate. A glass preform comprising an optical waveguide may also be attached to the routing structure. A plurality of electrical IC (EIC) die may be arrayed over the routing structure along with a plurality of photonic IC (PIC). Each PIC may be coupled to an optical waveguide within the glass preform. Conductive vias may extend through the glass substrate and be further coupled with a host substrate. The host substrate may comprise glass and an optical waveguide embedded within the glass. A vertical coupler may be attached to the host substrate to optically couple the host substrate to the optical waveguide within the glass preform of the multi-die package. Many of the multi-die packages may be arrayed over a routing structure on the host substrate.

Abstract: Various approaches for providing scalable network access processing. In some cases, approaches discussed relate to systems and methods for providing scalable zero trust network access control.

Abstract: Photonic integrated circuit packages and methods of manufacturing are disclosed. An example integrated circuit package includes: a semiconductor die; a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core including a through glass via extending between opposing first and second surfaces of the glass core, the glass core including a recess spaced apart from the through glass via, the recess defined by a third surface of the glass core, the recess having a different shape than the through glass via; and a reflective metal disposed on the third surface to define a mirror, the reflective metal also disposed between a wall of the through glass via and a conductive material disposed in the through glass via.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: A method of placing an implant at one or more bone portions includes inserting a pinning and drilling instrument a first distance into a bone portion at a location at the bone portion such that a pin portion of the pinning and drilling instrument is inserted into the bone portion at the location; after inserting the pinning and drilling instrument the first distance into the bone portion, creating an implant receiving aperture at the location by further inserting the pinning and drilling instrument a second further distance into the bone portion at the location at the bone portion such that a drill portion of the pinning and drilling instrument is inserted into the bone portion to create the implant receiving aperture at the location; and placing an implant at the implant receiving aperture.

Abstract: An implantable device includes one or more anchors. The anchors are configured to capture one or more leaflets of a native heart valve. The one or more anchors are configured to draw native valve leaflets into the device. The anchor portion can be extendable and retractable. The one or more anchors can be closed to secure the implantable device to the native valve leaflets.

Abstract: A method of fixating bones for fusion includes positioning an implant guide sleeve at a first bone and a second bone and across a separation between the first bone from the second bone. The method further includes using the implant guide sleeve to guide creation of a first implant hole in the first bone and to guide creation of a second implant hole in the second bone, aligning an inserter, operatively connected to an implant, with the implant guide sleeve, and advancing the inserter, relative to the implant guide sleeve, to position the implant in contact with the first bone and the second bone with the implant bridging between the first bone and the second bone.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Embodiments of the present disclosure include techniques for cooperative memory management. In one embodiment, a database management system includes a memory manager for managing a memory buffer. The memory buffer is configured to allocate memory to table data and temporary data dynamically. In some embodiments, table data memory allocations are reduced and temporary data memory allocations are increased to process queries. Temporary data memory allocations may be increased to store temporary data associated with one or more portions of a query. The memory buffer reallocates table data memory allocations and temporary data memory allocations as needed to more efficiently use available memory.

Abstract: Systems, devices, and methods are discussed for providing ZTNA control across multiple related, but independently provisioned networks.

Abstract: Aspects of the subject disclosure may include, for example, obtaining first data pertaining to an outage in a first portion of a communications system, obtaining second data pertaining to a relationship between the first portion of the communications system and a second portion of the communications system, analyzing the first data the second data to identify a risk to communication services facilitated by the second portion of the communications system, determining that the risk is greater than a threshold, and generating, based on the determining, a recommendation for reducing the risk. Other embodiments are disclosed.

Abstract: A method of modifying a bone surface for receiving an implant includes: positioning a contour guide at a first bone and a second bone and across a separation between the first bone and the second bone; using the contour guide to modify a surface region of at least one of the first bone and the second bone to form a modified surface region at one or both of the first bone and the second bone; and positioning an implant in contact at least with the modified surface region.

Abstract: Various approaches for providing scalable network access processing. In some cases, approaches discussed relate to systems and methods for providing scalable zero trust network access control.

Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

Abstract: Various approaches for providing scalable network access processing. In some cases, approaches discussed relate to systems and methods for providing scalable zero trust network access control.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed utilizing photonic integrated circuits with glass cores. An example apparatus comprises a primary package substrate including a glass core and first contacts along an outer surface of the primary package substrate, a photonic integrated circuit (PIC) within the primary package substrate adjacent a surface of the glass core, and a secondary package substrate supporting a semiconductor die on a first side of the secondary package substrate, the secondary package substrate including second contacts on a second side of the secondary package substrate, the first contacts electrically coupled to the second contacts.