Abstract: A critical path minimization technique uses a novel reshaping layout reorganization mechanism. Circuit objects and/or object fragments which belong to a critical path in a reference direction are reshaped using resources of an orthogonal direction. A fragment may decrease its size in the layout in the reference direction and increase its size in the orthogonal direction. Types of reshaping include via, diode or tie reshaping, transistor chain reshaping by transistor finger resizing, and transistor chain reshaping by transistor finger removing. The removal technique can include removal of one (or 2N+1) transistor finger(s) from an edge (e.g., beginning or end) of a transistor chain, removal of two (or 2N) adjacent transistor fingers from any position of a transistor chain, removal of one (or 2N+1) transistor finger(s) from inside a transistor chain with diffusion gap insertion, and removal of a group or series of transistor fingers.

Abstract: Methods (100, 200, 250) and data processing system (300) for automatically placing ties (136, 138, 146, 148) and connection elements within an integrated circuit (120). Integrated circuit dimensions (102), element locations and element dimensions (104), and tie placement rules (106) are received for a particular integrated circuit (120). The quantities are then processed to place ties within the integrated circuit (108). Tie placement rules include tie spacings (164, 166), well edge spacings (162), and diffusion spacings (168) to prevent SCR latch up and gate threshold voltage drift. Tie placement methods (100, 200) automatically place ties within the integrated circuit (120) to comply with tie spacing rules and also consider estimated compactions so that tie numbers are minimized. Associated data processing system (300) and computer readable medium operate in conjunction with the methods of the present invention.

Abstract: The present invention relates to a method (100, 150, 200) and associated data processing system (250) for determining a standard cell height within an integrated circuit design. A plurality of cell types, each cell type including a plurality of cell structures are received (102). Then, weighting values are received, one for each cell type (104). Expected intercell connection densities are preferably also received. Various target cell heights are processed with the plurality of cell types, the weighting values, and the expected intercell connection densities to generate a standard cell height (106). The standard cell height used with the integrated circuit design produces an optimized integrated circuit area, preferably a minimum area. The present invention includes a method (200) and system (250) for selecting an optimized standard cell height that, when used with a place-and-route tool to generate a physical design file (204) produces an optimized physical integrated circuit design.