Abstract: An overvoltage protection assembly includes a rail and a mount device. The mount device includes a base member having front and rear opposed surfaces and a mounting structure on the rear surface. The mounting structure secures the base member to the rail. An overvoltage protection module is mounted on the front surface of the base member.

Abstract: An overvoltage protection assembly includes a rail and a mount device. The mount device includes a base member having front and rear opposed surfaces and a mounting structure on the rear surface. The mounting structure secures the base member to the rail. An overvoltage protection module is mounted on the front surface of the base member.

Abstract: An overvoltage protection device includes a housing including a first substantially planar electrical contact surface and a sidewall. The housing defines a cavity therein and has an opening in communication with the cavity. An electrode member of the device includes a second substantially planar electrical contact surface facing the first electrical contact surface and disposed within the cavity. A portion of the electrode member extends out of the cavity and through the opening. A wafer formed of varistor material and having first and second opposed, substantially planar wafer surfaces is positioned within the cavity and between the first and second electrical contact surfaces with the first and second wafer surfaces engaging the first and second electrical contact surfaces, respectively.

Abstract: An overvoltage protection device includes a first electrode member having a first substantially planar contact surface and a second electrode member having a second substantially planar contact surface facing the first contact surface. A wafer formed of varistor material and having first and second opposed, substantially planar wafer surfaces is positioned between the first and second contact surfaces with the first and second wafer surfaces engaging the first and second contact surfaces, respectively. The contact surfaces may apply a load to the wafer surfaces. Preferably, the electrode members have a combined thermal mass which is substantially greater than a thermal mass of the wafer. The wafer may be formed by slicing a rod of varistor material. The device may include a housing including the first substantially planar contact surface and a sidewall, the housing defining a cavity within which the second electrode is disposed.