Patents by Inventor Robert Michael Echols

Robert Michael Echols has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110116242
    Abstract: Method and apparatus for constructing and operating a printed circuit board assembly (PCBA). In some embodiments, a plurality of electronic components are attached to a first side of a substrate that has at least one electrical lead that connects the electrical components is present on an opposite second side of the substrate. A primary film is adhered to the second side of the substrate to create an air tight seal around each electrical lead. A secondary film is then adhered to the primary film and provides a cantilevered lift tab that extends outside the bounds of the primary film. The secondary film has a lower bond strength than the primary film.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 19, 2011
    Applicant: Seagate Technology LLC
    Inventors: Michael Richard Fabry, Robert Michael Echols, William Brad Green
  • Patent number: 7682879
    Abstract: A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: March 23, 2010
    Assignee: Seagate Technology LLC
    Inventors: Robert Michael Echols, Michael Richard Fabry
  • Publication number: 20070228532
    Abstract: A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first material is dispensed between the active surface of the die and the substrate. A second material is dispensed on at least a portion of the non-active surface of the die. The second material is different than the first material and the first material and the second material are simultaneously cured.
    Type: Application
    Filed: July 27, 2006
    Publication date: October 4, 2007
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Robert Michael Echols, Michael Richard Fabry
  • Patent number: 6680436
    Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: January 20, 2004
    Assignee: Seagate Technology LLC
    Inventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson
  • Publication number: 20020046860
    Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.
    Type: Application
    Filed: March 29, 2001
    Publication date: April 25, 2002
    Inventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson