Abstract: According to certain embodiments, a micro controller unit of a smart computer case provides, based on the identification of the smart computer case: 1) lighting control of a plurality of individually addressable LEDs associated with computer case fans, logo panels and integrated lighting features, 2) fan speed control and monitoring, and 3) monitoring of temperature sensors. According to certain embodiments, each LED need not be RGB but instead can be single color LEDs.

Abstract: A data distributer device for controlling the lighting effects of a series of LEDs associated with a plurality of LED computer fans is disclosed. According to certain embodiments, the data distributer device comprises a printed circuit board, a plurality of LED fan data connectors on the printed circuit board, a controller data input connector on the printed circuit board and at least one power input connector on the printed circuit board. The plurality of LED fan data connectors is electrically arranged serially on the printed circuit board.

Abstract: According to certain embodiments, a computer chassis is divided into three isolated thermal chambers to confine the heat loads in separately managed areas.

Abstract: According to certain embodiments, a micro controller unit of a smart computer case provides, based on the identification of the smart computer case: 1) lighting control of a plurality of individually addressable LEDs associated with computer case fans, logo panels and integrated lighting features, 2) fan speed control and monitoring, and 3) monitoring of temperature sensors. According to certain embodiments, each LED need not be RGB but instead can be single color LEDs.

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract: A data distributer device for controlling the lighting effects of a series of LEDs associated with a plurality of LED computer fans is disclosed. According to certain embodiments, the data distributer device comprises a printed circuit board, a plurality of LED fan data connectors on the printed circuit board, a controller data input connector on the printed circuit board and at least one power input connector on the printed circuit board. The plurality of LED fan data connectors is electrically arranged serially on the printed circuit board.

Abstract: A side-discharge blower fan unit with ductwork for controlling air flow is disclosed, according to certain embodiments.

Abstract: A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.

Abstract: A side-discharge blower fan unit with ductwork for controlling air flow is disclosed, according to certain embodiments.

Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.

Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.

Abstract: A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract: An active cooling system that includes a thermo electric cooler device is used to improve heat transfer from a processor in the computer such that the resulting temperature of the processor in the computer drops below the ambient temperature or the temperature of the cooling liquid that is returning from a heat exchanger.

Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.

Abstract: A pressure-activated server cooling system includes a server rack that houses one or more servers. The server rack has an interior plenum. A fan is coupled to the server rack that exhausts air from inside the plenum to outside the server rack. A differential pressure sensor collects pressure sensor data and a fan controller, which is operatively connected to the fan and the differential pressure sensor, activates the fan in response to the pressure sensor data. In some embodiments, the fan controller increases the speed of the fan when the pressure sensor data indicates greater than atmospheric pressure in the plenum.

Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.

Abstract: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air through the server away from temperature sensitive devices. The baffle may include an inlet that receives hot air and an outlet through which hot air may exit. One or more fans may be used to direct air through the baffle. For example, the baffle may direct heat from the baffle inlet to the baffle outlet, directing heat away from temperature sensitive devices within the server.