Patents by Inventor Robert Michael Kinstle, III
Robert Michael Kinstle, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10514732Abstract: According to certain embodiments, a micro controller unit of a smart computer case provides, based on the identification of the smart computer case: 1) lighting control of a plurality of individually addressable LEDs associated with computer case fans, logo panels and integrated lighting features, 2) fan speed control and monitoring, and 3) monitoring of temperature sensors. According to certain embodiments, each LED need not be RGB but instead can be single color LEDs.Type: GrantFiled: May 28, 2018Date of Patent: December 24, 2019Assignee: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Patent number: 10517157Abstract: A data distributer device for controlling the lighting effects of a series of LEDs associated with a plurality of LED computer fans is disclosed. According to certain embodiments, the data distributer device comprises a printed circuit board, a plurality of LED fan data connectors on the printed circuit board, a controller data input connector on the printed circuit board and at least one power input connector on the printed circuit board. The plurality of LED fan data connectors is electrically arranged serially on the printed circuit board.Type: GrantFiled: January 4, 2018Date of Patent: December 24, 2019Assignee: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Patent number: 10459498Abstract: According to certain embodiments, a computer chassis is divided into three isolated thermal chambers to confine the heat loads in separately managed areas.Type: GrantFiled: January 7, 2019Date of Patent: October 29, 2019Assignee: Corsair Memory, Inc.Inventors: Robert Michael Kinstle, III, Dennis Wai Cheung Lee, Joseph-Eamonn L. Clerkin, Dustin Alexander Sklavos
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Publication number: 20180341297Abstract: According to certain embodiments, a micro controller unit of a smart computer case provides, based on the identification of the smart computer case: 1) lighting control of a plurality of individually addressable LEDs associated with computer case fans, logo panels and integrated lighting features, 2) fan speed control and monitoring, and 3) monitoring of temperature sensors. According to certain embodiments, each LED need not be RGB but instead can be single color LEDs.Type: ApplicationFiled: May 28, 2018Publication date: November 29, 2018Applicant: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Publication number: 20180192493Abstract: A data distributer device for controlling the lighting effects of a series of LEDs associated with a plurality of LED computer fans is disclosed. According to certain embodiments, the data distributer device comprises a printed circuit board, a plurality of LED fan data connectors on the printed circuit board, a controller data input connector on the printed circuit board and at least one power input connector on the printed circuit board. The plurality of LED fan data connectors is electrically arranged serially on the printed circuit board.Type: ApplicationFiled: January 4, 2018Publication date: July 5, 2018Inventor: Robert Michael Kinstle, III
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Patent number: 9797408Abstract: A side-discharge blower fan unit with ductwork for controlling air flow is disclosed, according to certain embodiments.Type: GrantFiled: November 25, 2015Date of Patent: October 24, 2017Inventor: Robert Michael Kinstle, III
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Patent number: 9766668Abstract: A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.Type: GrantFiled: June 14, 2016Date of Patent: September 19, 2017Inventors: Robert Michael Kinstle, III, Michael Hooper
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Publication number: 20170146027Abstract: A side-discharge blower fan unit with ductwork for controlling air flow is disclosed, according to certain embodiments.Type: ApplicationFiled: November 25, 2015Publication date: May 25, 2017Applicant: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Patent number: 9645619Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.Type: GrantFiled: May 29, 2015Date of Patent: May 9, 2017Assignee: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Patent number: 9622386Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.Type: GrantFiled: June 2, 2015Date of Patent: April 11, 2017Assignee: CORSAIR MEMORY, INC.Inventor: Robert Michael Kinstle, III
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Publication number: 20170052576Abstract: A small form factor computer chassis is disclosed. The computer chassis includes a solid bulkhead that separates the computer chassis cavity into two thermal chambers. According to certain embodiments, a radiator that is oriented along the XZ plane and is along a wall of computer chassis helps remove heat from a liquid coolant arriving form a cold plate associated with a CPU and/or a GPU.Type: ApplicationFiled: June 14, 2016Publication date: February 23, 2017Inventors: Robert Michael Kinstle, III, Michael Hooper
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Publication number: 20160349809Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.Type: ApplicationFiled: May 29, 2015Publication date: December 1, 2016Applicant: Corsair Memory, Inc.Inventor: Robert Michael Kinstle, III
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Publication number: 20160161998Abstract: An active cooling system that includes a thermo electric cooler device is used to improve heat transfer from a processor in the computer such that the resulting temperature of the processor in the computer drops below the ambient temperature or the temperature of the cooling liquid that is returning from a heat exchanger.Type: ApplicationFiled: December 5, 2014Publication date: June 9, 2016Inventor: Robert Michael Kinstle, III
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Publication number: 20150346783Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.Type: ApplicationFiled: June 2, 2015Publication date: December 3, 2015Applicant: CORSAIR MEMORY, INC.Inventor: Robert Michael Kinstle, III
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Publication number: 20150003010Abstract: A pressure-activated server cooling system includes a server rack that houses one or more servers. The server rack has an interior plenum. A fan is coupled to the server rack that exhausts air from inside the plenum to outside the server rack. A differential pressure sensor collects pressure sensor data and a fan controller, which is operatively connected to the fan and the differential pressure sensor, activates the fan in response to the pressure sensor data. In some embodiments, the fan controller increases the speed of the fan when the pressure sensor data indicates greater than atmospheric pressure in the plenum.Type: ApplicationFiled: May 28, 2014Publication date: January 1, 2015Applicant: Silicon Graphics International Corp.Inventor: Robert Michael Kinstle, III
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Publication number: 20140268553Abstract: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin pitch. The system may further include a rear CPU disposed in line with the front CPU and a rear heat sink coupled to the rear CPU. The rear heat sink may have a plurality of fins and a corresponding fin pitch. The fin pitch of the rear heat sink may be higher than the fin pitch of the front heat sink. In another embodiment, the front and rear heat sinks may be coupled together by one or more heat pipes.Type: ApplicationFiled: June 28, 2013Publication date: September 18, 2014Inventors: Kevin Lee Van Pelt, Theodore Robert Johnson, Robert Michael Kinstle III
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Publication number: 20140268552Abstract: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air through the server away from temperature sensitive devices. The baffle may include an inlet that receives hot air and an outlet through which hot air may exit. One or more fans may be used to direct air through the baffle. For example, the baffle may direct heat from the baffle inlet to the baffle outlet, directing heat away from temperature sensitive devices within the server.Type: ApplicationFiled: June 29, 2013Publication date: September 18, 2014Applicant: Silicon Graphics International Corp.Inventors: Ronald Provenzale, Seitu Barron, Robert Michael Kinstle III, Kevin Schlichter
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Publication number: 20140268551Abstract: High pressure fans are mounted in the middle of an enclosure to create a low pressure zone and a high pressure zone within the enclosure. The high pressure fans pull air through high density sets of hard disk drives in the back of an enclosure and push air through high density disk drives in the front of the enclosure. Being positioned in the middle of an enclosure allows the high pressure fans to mix hot air pulled through the low pressure zone with cool air existing on the other side of the fans. The fans then push the cool mixed air through the next set of hard drives, forming a high pressure zone and allowing the air to exit at the front of the enclosure.Type: ApplicationFiled: September 26, 2013Publication date: September 18, 2014Applicant: Silicon Graphics International Corp.Inventors: Kevin Lee Van Pelt, Robert Michael Kinstle, III