Patents by Inventor Robert Michael Smythe
Robert Michael Smythe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9322580Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.Type: GrantFiled: February 10, 2014Date of Patent: April 26, 2016Assignee: Laird Technologies, Inc.Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
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Patent number: 9222735Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: GrantFiled: September 8, 2014Date of Patent: December 29, 2015Assignee: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20140374080Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: ApplicationFiled: September 8, 2014Publication date: December 25, 2014Inventors: Richard F. Hill, Robert Michael Smythe
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Patent number: 8837151Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: GrantFiled: December 19, 2011Date of Patent: September 16, 2014Assignee: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20140150839Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.Type: ApplicationFiled: February 10, 2014Publication date: June 5, 2014Applicant: Laird Technologies, Inc.Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
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Patent number: 8649179Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.Type: GrantFiled: February 5, 2011Date of Patent: February 11, 2014Assignee: Laird Technologies, Inc.Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
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Publication number: 20120201008Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.Type: ApplicationFiled: February 5, 2011Publication date: August 9, 2012Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
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Publication number: 20120174956Abstract: An example thermoelectric module generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layers of the first and second laminates are at least partially removed to form electrically conductive pads on the respective first and second laminates. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together.Type: ApplicationFiled: January 30, 2012Publication date: July 12, 2012Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Robert Michael Smythe, Jeffrey Gerard Hershberger, Richard F. Hill
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Patent number: 8193439Abstract: An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module.Type: GrantFiled: June 23, 2009Date of Patent: June 5, 2012Assignee: Laird Technologies, Inc.Inventors: Robert Michael Smythe, Jeffrey Gerard Hershberger
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Publication number: 20120087094Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: ApplicationFiled: December 19, 2011Publication date: April 12, 2012Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20120061135Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material.Type: ApplicationFiled: September 14, 2010Publication date: March 15, 2012Applicant: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Patent number: 8081468Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: GrantFiled: June 17, 2009Date of Patent: December 20, 2011Assignee: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20110030754Abstract: An example thermoelectric module of the present disclosure generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layer of the first laminate is at least partially removed to form electrically conductive pads on the first laminate. The electrically conductive layer of the second laminate is at least partially removed to form electrically conductive pads on the second laminate. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together.Type: ApplicationFiled: September 15, 2009Publication date: February 10, 2011Applicant: Laird Technologies, Inc.Inventors: Robert Michael Smythe, Jeffrey Gerard Hershberger, Richard F. Hill
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Publication number: 20110000516Abstract: In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion.Type: ApplicationFiled: August 2, 2010Publication date: January 6, 2011Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Richard I. Roser, Robert Michael Smythe
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Publication number: 20100321895Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: ApplicationFiled: June 17, 2009Publication date: December 23, 2010Applicant: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20100321897Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies. In exemplary embodiments, thermal interface material is disposed on or along one side of a flexible thermally-conductive sheet. In other embodiments, a flexible thermally-conductive sheet is bonded to, encapsulated within, or sandwiched between first and second layers of a thermal interface material. The flexible thermally-conductive sheet may be a flexible perforated graphite sheet. The thermal interface material may be thermally-conductive polymer. The perforations in the graphite sheet may enable a polymer-to-polymer bond to form that may help mechanically bond the first and second layers to the graphite sheet and/or may help provide heat conduction between the first and second layers.Type: ApplicationFiled: June 17, 2009Publication date: December 23, 2010Applicant: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20100319744Abstract: An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module.Type: ApplicationFiled: June 23, 2009Publication date: December 23, 2010Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Robert Michael Smythe, Jeffrey Gerard Hershberger