Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.

Abstract: Various embodiments include a connector head assembly for an electrical cable attached to one or more receptacle connectors. The connector head assembly may include an elongate overmold having a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The connector head assembly may also include a pull tab pivotally attached to the elongate overmold on an upper surface thereof. A pulling force applied to the pull tab may be configured to separate the receptacle connector from a receptacle in which the receptacle connector is configured to be held.

Abstract: A multiple layer printed circuit board including a plurality of layers, vertical interconnect accesses (VIAs), and a vertical interconnect access (VIA) bridge. The layers may include signal layers, prepreg substrate layers disposed between the signal layers, ground plane layers, wherein each of the ground plane layers abuts one of the prepreg substrate layers, inner signal layers, wherein each of the inner signal layers abuts one of the prepreg substrate layers, and a core substrate layer disposed between the signal layers, wherein two of the inner signal layers abut opposed sides of the core substrate layer. The VIAs extend through at least some of the layers, wherein each of the VIAs is formed by aligned apertures through adjoining ones of the prepreg substrate layers, ground plane layers, and inner signal layers. The VIA bridge is coupled to the VIAs to convey heat to a heat sink.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

Abstract: Various embodiments include a connector head assembly for an electrical cable attached to one or more receptacle connectors. The connector head assembly may include an elongate overmold having a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The connector head assembly may also include a pull tab pivotally attached to the elongate overmold on an upper surface thereof. A pulling force applied to the pull tab may be configured to separate the receptacle connector from a receptacle in which the receptacle connector is configured to be held.

Abstract: A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.