Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: A superconductor junction includes a normal metal layer having a first side and a second side, an insulating layer overlying the second side of the normal metal layer, and a first superconductor layer formed of a first superconductor material that overlies a side of the insulating layer opposite the side that overlies the normal metal layer. The superconductor junction further includes a second superconductor layer formed of a second superconductor material with a first side overlying a side of the first superconductor material opposite the side that overlies the insulating layer. The second superconductor material has a higher diffusion coefficient than the first superconductor material and/or the second superconductor material has a lower recombination coefficient than the first superconductor metal layer. A normal metal layer quasiparticle trap is coupled to a second side of the second superconductor layer.

Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

Abstract: A method is described for shutting down a Fischer-Tropsch reactor fed with a reactant gas mixture comprising a synthesis gas and a recycle gas recovered from the Fischer-Tropsch reactor in a synthesis loop, said Fischer-Tropsch reactor containing a Fischer-Tropsch catalyst cooled indirectly by a coolant under pressure, comprising the steps of: (a) depressurising the coolant to cool the reactant gas mixture to quench Fischer-Tropsch reactions taking place in the Fischer-Tropsch reactor, (b) stopping the synthesis gas feed to the Fischer-Tropsch reactor, and (c) maintaining circulation of the recycle gas through the Fischer-Tropsch reactor during steps (a) and (b) to remove heat from the Fischer-Tropsch reactor. The method safely facilitates a more rapid return to operating conditions than a full shut-down.

Abstract: A reactor tube for a tubular reactor and a retaining device associated with the reactor tube; the reactor tube comprising an elongate tube defining a bore for receiving in use a catalyst and having an outlet at one end of the bore for discharging the catalyst out of the bore; the retaining device being configured to be rotatable between a first position and a second position; wherein in the first position the retaining device at least partially obstructs the outlet for retaining the catalyst within the bore; and in the second position the outlet is unobstructed sufficiently for permitting discharge of the catalyst out of the outlet.

Abstract: A superconductor junction includes a normal metal layer having a first side and a second side, an insulating layer overlying the second side of the normal metal layer, and a first superconductor layer formed of a first superconductor material that overlies a side of the insulating layer opposite the side that overlies the normal metal layer. The superconductor junction further includes a second superconductor layer formed of a second superconductor material with a first side overlying a side of the first superconductor material opposite the side that overlies the insulating layer. The second superconductor material has a higher diffusion coefficent than the first superconductor material and/or the second superconductor material has a lower recombination coefficent than the first superconductor metal layer. A normal metal layer quasiparticle trap is coupled to a second side of the second superconductor layer.

Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

Abstract: The systems and methods generally apply a machine learning algorithm that is configured to automatically reconcile and update field costs. The algorithm may also predict when field cost data has not captured all or substantially all of the costs based on historical data. The systems and methods may either flag the missing cost or automatically populate at least a portion or up to all of any missing field costs. Thus, machine learning and data analytic techniques may be implemented to reconcile field costs by using, for example, invoice and financial information.

Abstract: A towing mirror including: a mount adapted to be mounted to a vehicle cabin; an extension component including a first member or portion extending from said mount and a second member operatively connected to said first member or portion for movement relative thereto from a retracted position to an extended position; and a mirror component operatively connected to said second member for pivoting movement relative thereto about a generally horizontal axis extending substantially in the intended direction of travel of the vehicle cabin to which the mirror is to be mounted.

Abstract: A surface compactor machine includes a cylindrical drum defining a cylindrical space in an interior portion of the cylindrical drum and having a central axis of rotation, and a counterweight in the cylindrical space. The compactor further includes a non-driven support wheel affixed to the counterweight and in contact with an underlying portion of an interior surface of the cylindrical drum beneath the counterweight. A drive motor is provided in the cylindrical space, and a drive wheel is mechanically rotatable by the drive motor. The drive wheel contacts an inner surface of the cylindrical drum such that rotation of the drive wheel by the drive motor urges the cylindrical drum to rotate about the central axis of rotation.

Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Abstract: Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

Abstract: Systems and devices for cooling and dispensing a beverage fluid are disclosed herein. One beverage dispensing system includes a beverage tower comprising a tower body, a shank, and a faucet. In some implementations, a coolant line is routed proximal to a beverage supply line through the tower body, through the shank, and into the faucet. In these and other implementations, the faucet includes a removable nozzle having a supplemental portion of the coolant line. In these and still other implementations, the faucet include a removable nozzle having a second coolant line. The coolant line and the second coolant line are configured to transport a coolant medium proximal to a beverage fluid in the beverage supply line to maintain or adjust the temperature of the beverage fluid. Many other features are described herein.

Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

Abstract: Systems and devices for cooling and dispensing a beverage fluid are disclosed herein. One beverage dispensing system includes a beverage tower comprising a tower body, a shank, and a faucet. In some implementations, a coolant line is routed proximal to a beverage supply line through the tower body, through the shank, and into the faucet. In these and other implementations, the faucet includes a removable nozzle having a supplemental portion of the coolant line. In these and still other implementations, the faucet include a removable nozzle having a second coolant line. The coolant line and the second coolant line are configured to transport a coolant medium proximal to a beverage fluid in the beverage supply line to maintain or adjust the temperature of the beverage fluid. Many other features are described herein.

Abstract: A surface compactor machine includes a cylindrical drum defining a cylindrical space in an interior portion of the cylindrical drum and having a central axis of rotation, and a counterweight in the cylindrical space. The compactor further includes a non-driven support wheel affixed to the counterweight and in contact with an underlying portion of an interior surface of the cylindrical drum beneath the counterweight. A drive motor is provided in the cylindrical space, and a drive wheel is mechanically rotatable by the drive motor. The drive wheel contacts an inner surface of the cylindrical drum such that rotation of the drive wheel by the drive motor urges the cylindrical drum to rotate about the central axis of rotation.

Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.