Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.