Patents by Inventor Robert Montgomery

Robert Montgomery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293961
    Abstract: A method of manufacturing a cascode HEMT semiconductor device including a lead frame, a die pad with an indentation attached to the lead frame, and a HEMT die attached to the die pad. The HEMT die includes a HEMT source and a HEMT drain on a first side, and a HEMT gate on a second side. The device further includes a MOSFET die attached to the source of the HEMT die, and the MOSFET die includes a MOSFET source, a MOSFET gate and a MOSFET drain. The MOSFET drain is connected to the HEMT source, and the MOSFET source includes a MOSFET source clip. The MOSFET source clip includes a pillar so to connect the MOSFET source to the HEMT gate, and the connection between the MOSFET source to the HEMT gate is established by a conductive material.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: May 6, 2025
    Assignee: NEXPERIA B.V.
    Inventors: Ricardo Yandoc, Robert Montgomery, Adam Thomas Rosillo
  • Publication number: 20240392096
    Abstract: Provided is a stable blend of a petroleum atmospheric tower bottoms (ATBs) feedstock and 1-20 wt. % of plastic, based on the weight of the blend, with the plastic comprising polyethylene and/or polypropylene, and the plastic in the blend comprising finely dispersed microcrystalline particles having an average particle size of 10 micron to less than 100 microns. A process for preparing a stable blend of plastic and petroleum is provided, comprising mixing together a petroleum feed and a plastic comprising polyethylene and/or polypropylene and heating the mixture above the melting point of the plastic, but less than 500° F. Then cooling the plastic melt and petroleum feedstock liquid blend with mixing to a temperature below the melting point of the plastic.
    Type: Application
    Filed: May 22, 2024
    Publication date: November 28, 2024
    Applicant: Chevron U.S.A. Inc.
    Inventors: Joel Edward SCHMIDT, Richard L. GROVE, Robert MONTGOMERY, Tengfei LIU, Hye-Kyung Cho TIMKEN
  • Publication number: 20240352320
    Abstract: A method for making needle coke includes processing a feed comprising one or more renewable feedstocks in the presence of a cracking catalyst under fluidized catalytic cracking conditions to obtain a heavy cycle oil, delayed coking the heavy cycle oil under coking conditions to obtain an intermediate coke product, and calcining the intermediate coke product under calcinating conditions to obtain needle coke.
    Type: Application
    Filed: February 13, 2024
    Publication date: October 24, 2024
    Inventors: Tengfei Liu, Joel Edward Schmidt, Richard Grove, Robert Montgomery, Jon Peters, Christopher John Ross, Mahdi Khademi
  • Publication number: 20230174640
    Abstract: The present disclosure relates to uses of an anti-IL-6 antibody, e.g., clazakizumab in order to prevent, stabilize, reduce, or otherwise treat acute or chronic respiratory distress syndrome (ARDS or CRDS) and symptoms thereof such as lung damage, and also to treat cytokine storm syndrome, in patients with or suspected of having a bacterial, viral, or fungal infection, such as a coronavirus infection, e.g., COVID-19, SARS, MERS, or another bacterial or viral infection which may cause acute or chronic respiratory distress syndrome or cytokine storm syndrome.
    Type: Application
    Filed: March 17, 2021
    Publication date: June 8, 2023
    Applicant: Vitaeris Inc.
    Inventors: Kevin Chow, Edward Chong, Bonnie Lonze, Robert Montgomery
  • Publication number: 20230123782
    Abstract: A method of manufacturing a cascode HEMT semiconductor device including a lead frame, a die pad with an indentation attached to the lead frame, and a HEMT die attached to the die pad. The HEMT die includes a HEMT source and a HEMT drain on a first side, and a HEMT gate on a second side. The device further includes a MOSFET die attached to the source of the HEMT die, and the MOSFET die includes a MOSFET source, a MOSFET gate and a MOSFET drain. The MOSFET drain is connected to the HEMT source, and the MOSFET source includes a MOSFET source clip. The MOSFET source clip includes a pillar so to connect the MOSFET source to the HEMT gate, and the connection between the MOSFET source to the HEMT gate is established by a conductive material.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Applicant: NEXPERIA B.V.
    Inventors: Ricardo Yandoc, Robert Montgomery, Adam Thomas Rosillo
  • Patent number: 11538744
    Abstract: This disclosure relates to a cascode HEMT semiconductor device including a lead frame, a die pad attached to the lead frame, and a HEMT die attached to the die pad. The HEMT die includes a HEMT source and a HEMT drain on a first side, and a HEMT gate on a second side. The device further includes a MOSFET die attached to the source of the HEMT die, and the MOSFET die includes a MOSFET source, a MOSFET gate and a MOSFET drain. The MOSFET drain is connected to the HEMT source, and the MOSFET source includes a MOSFET source clip. The MOSFET source clip includes a pillar so to connect the MOSFET source to the HEMT gate, and the connection between the MOSFET source to the HEMT gate is established by a conductive material.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: December 27, 2022
    Assignee: Nexperia B.V.
    Inventors: Ricardo Yandoc, Robert Montgomery, Adam Thomas Rosillo
  • Patent number: 11194698
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. A method includes electrically triggering, with a rotate command, at least one mechanical actuator to rotate a frame to successively present different faces of the frame to a camera of a mobile hardware device. A method includes simulating one or more touch input events on a mobile hardware device for each successively presented different face of a frame. At least one mechanical actuator and a mobile hardware device are disposed within an enclosure that comprises a light source. A method includes receiving data associated with simulated one or more touch input events and a camera of a mobile hardware device from the mobile hardware device over a data network.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: December 7, 2021
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Patent number: 11188452
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. A method includes electrically triggering, with a rotate command, at least one mechanical actuator to rotate a frame to successively present different faces of the frame to a camera of a mobile hardware device. A method includes simulating one or more touch input events on a mobile hardware device for each successively presented different face of a frame. Simulated one or more touch input events are received as mirrored one or more actual touch input events on a different mobile hardware device. A method includes receiving data associated with simulated one or more touch input events and a camera of a mobile hardware device from the mobile hardware device over a data network.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 30, 2021
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Publication number: 20210296218
    Abstract: This disclosure relates to a cascode HEMT semiconductor device including a lead frame, a die pad attached to the lead frame, and a HEMT die attached to the die pad. The HEMT die includes a HEMT source and a HEMT drain on a first side, and a HEMT gate on a second side. The device further includes a MOSFET die attached to the source of the HEMT die, and the MOSFET die includes a MOSFET source, a MOSFET gate and a MOSFET drain. The MOSFET drain is connected to the HEMT source, and the MOSFET source includes a MOSFET source clip. The MOSFET source clip includes a pillar so to connect the MOSFET source to the HEMT gate, and the connection between the MOSFET source to the HEMT gate is established by a conductive material.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 23, 2021
    Applicant: NEXPERIA B.V.
    Inventors: Ricardo YANDOC, Robert MONTGOMERY, Adam Thomas ROSILLO
  • Patent number: 11093373
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. A method includes electrically triggering, with a rotate command, at least one mechanical actuator to rotate a frame to successively present different faces of the frame to a camera of a mobile hardware device. A method includes simulating one or more touch input events on a mobile hardware device with a delay period between each of the simulated one or more touch input events for each successively presented different face of a frame. A method includes receiving data associated with simulated one or more touch input events and a camera of a mobile hardware device from the mobile hardware device over a data network.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: August 17, 2021
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Patent number: 11080170
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. A method includes electrically triggering, with a rotate command, at least one mechanical actuator to rotate a frame to successively present different faces of the frame to a camera of a mobile hardware device. A method includes simulating one or more touch input events on a mobile hardware device for each successively presented different face of a frame. A method includes receiving data associated with simulated one or more touch input events and a camera of a mobile hardware device from the mobile hardware device over a data network. Received data includes a hierarchical scene tree having a plurality of nodes associated with objects displayed on a screen of at least one of the mobile hardware devices. A method includes dynamically altering a parameter of one or more nodes based on user input.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: August 3, 2021
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Patent number: 10909027
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. A method includes electrically triggering, with a rotate command, at least one mechanical actuator to rotate a frame to successively present different faces of the frame to a camera of a mobile hardware device. A method includes simulating one or more touch input events on a mobile hardware device for each successively presented different face of a frame. A method includes receiving data associated with simulated one or more touch input events and a camera of a mobile hardware device from the mobile hardware device over a data network.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: February 2, 2021
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Patent number: 10818613
    Abstract: In one implementation, a method for forming ultra-thin semiconductor components includes fabricating multiple devices including a first device and a second device in a semiconductor wafer, and forming a street trench within the semiconductor wafer and between the first and second devices. The method continues with forming a dielectric skeleton structure over the semiconductor wafer, the dielectric skeleton structure laterally extending to at least partially cover the first and second devices, while also substantially filling the street trench. The method continues with thinning the semiconductor wafer from a backside to expose the dielectric skeleton structure in the street trench to form a first ultra-thin semiconductor component having the first device, and a second ultra-thin semiconductor component having the second device. The method can conclude with cutting through the dielectric skeleton structure to singulate the first and second ultra-thin semiconductor components.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 27, 2020
    Assignee: Infineon Technologies Americas Corp.
    Inventor: Robert Montgomery
  • Patent number: 10757274
    Abstract: A system is provided for processing documents. In particular, the system incorporates a feeder for feeding documents to a device for further processing of the documents. For instance, the system finds particular application in the field of document imaging in which a variety of documents of varying sizes and orientation are to be fed to an imaging system, such as a document scanner. The system may provide a sorting station that receives documents from a work station and sorts the documents to a plurality of sort locations. The system may export the image data for the documents to a fileserver so that a remote operator can provide instructions for the processing of the documents so that the documents can be subsequently processed according to the instructions provided by the operator.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: August 25, 2020
    Assignee: OPEX Corporation
    Inventor: Robert Montgomery
  • Patent number: 10495651
    Abstract: Methods and kits for measuring levels of von Willebrand factor function in a sample without using a platelet aggregation agonist, such as ristocetin, comprising recombinant glycoprotein Ib? having a combination of G233V, D235Y and M239V mutations and an agent to detect a complex between the recombinant glycoprotein Ib? and von Willebrand factor.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: December 3, 2019
    Assignees: Versiti Blood Research Institute Foundation, Inc., The Medical College of Wisconsin, Inc.
    Inventor: Robert Montgomery
  • Publication number: 20190268479
    Abstract: A system is provided for processing documents. In particular, the system incorporates a feeder for feeding documents to a device for further processing of the documents. For instance, the system finds particular application in the field of document imaging in which a variety of documents of varying sizes and orientation are to be fed to an imaging system, such as a document scanner. The system may provide a sorting station that receives documents from a work station and sorts the documents to a plurality of sort locations. The system may export the image data for the documents to a fileserver so that a remote operator can provide instructions for the processing of the documents so that the documents can be subsequently processed according to the instructions provided by the operator.
    Type: Application
    Filed: February 25, 2019
    Publication date: August 29, 2019
    Inventor: Robert Montgomery
  • Publication number: 20190229072
    Abstract: In one implementation, a method for forming ultra-thin semiconductor components includes fabricating multiple devices including a first device and a second device in a semiconductor wafer, and forming a street trench within the semiconductor wafer and between the first and second devices. The method continues with forming a dielectric skeleton structure over the semiconductor wafer, the dielectric skeleton structure laterally extending to at least partially cover the first and second devices, while also substantially filling the street trench. The method continues with thinning the semiconductor wafer from a backside to expose the dielectric skeleton structure in the street trench to form a first ultra-thin semiconductor component having the first device, and a second ultra-thin semiconductor component having the second device. The method can conclude with cutting through the dielectric skeleton structure to singulate the first and second ultra-thin semiconductor components.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventor: Robert Montgomery
  • Patent number: 10353806
    Abstract: Apparatuses, systems, methods, and computer program products are presented for multi-platform testing automation. An apparatus includes one or more hardware server devices in communication with an array of mobile hardware devices over a data network. A hardware server device is configured to simulate one or more touch input events on mobile hardware devices over a data network. A hardware server is configured to receive data associated with simulated one or more touch input events from mobile hardware devices over a data network.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: July 16, 2019
    Assignee: MX TECHNOLOGIES, INC.
    Inventors: Brandon Dewitt, Ryan McBride, Shane Smit, Cristian Chirinos, Robert Montgomery, Garrett Thornburg, Jonathan Carstens, Daniel Ries
  • Patent number: 10290588
    Abstract: In one implementation, a method for forming ultra-thin semiconductor components includes fabricating multiple devices including a first device and a second device in a semiconductor wafer, and forming a street trench within the semiconductor wafer and between the first and second devices. The method continues with forming a dielectric skeleton structure over the semiconductor wafer, the dielectric skeleton structure laterally extending to at least partially cover the first and second devices, while also substantially filling the street trench. The method continues with thinning the semiconductor wafer from a backside to expose the dielectric skeleton structure in the street trench to form a first ultra-thin semiconductor component having the first device, and a second ultra-thin semiconductor component having the second device. The method can conclude with cutting through the dielectric skeleton structure to singulate the first and second ultra-thin semiconductor components.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 14, 2019
    Assignee: Infineon Technologies Americas Corp.
    Inventor: Robert Montgomery
  • Patent number: 9778272
    Abstract: Methods and kits for measuring levels of von Willebrand factor function in a sample without using a platelet aggregation agonist, such as ristocetin, comprising recombinant glycoprotein Ib? having at least two of a G233V, D235Y and M239V mutations and an agent to detect a complex between the recombinant glycoprotein Ib? and von Willebrand factor.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: October 3, 2017
    Assignees: Blood Center Research Foundation, The Medical College of Wisconsin, Inc.
    Inventor: Robert Montgomery