Abstract: A method includes mounting an electronic component to a circuit board. Solder paste is applied to a board pad of the circuit board and a terminal pad of an electrical component is aligned with the board pad. The terminal includes a pad feature and a pad base. The solder paste is liquefied to cause the solder paste to flow along the pad feature. Then the solder paste is cooled to form a solder joint. The solder joint bonds the board pad and the pad base and forms a connection between the circuit board and the electrical component. Because this solder joint is subject to reduced stress at interface junctures of the solder joint, the solder joint is more resilient than conventional solder joints.

Abstract: A thermally enhanced BGA semiconductor device 10 having a heat sink 12 formed from a single piece of material with an expanded base and a pedestal in contact with a semiconductor chip 11. The pedestal is aligned through a window opening in a substrate 13 and the top surface of the base is adhered to the substrate. The heat sink 12 with an expanded base provides a path for rapid and efficient heat spreading and dissipation, a stand-off and an aid to improved package planarity during reflow to a PCB, and a long path for ingress of contaminants into the package. The device is amenable to high volume, low cost production.