Patents by Inventor Robert MUMGAARD

Robert MUMGAARD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240013960
    Abstract: A magnet system and method of operating may be used in connection with operating a superconducting electromagnet, for example in a tokamak. The magnet system includes a coil having windings retained within a non-insulated structure, so that current can pass both along the windings to generate a magnetic field, and between the windings. The amount of current passing through the coil is trimmed using a bypass circuit, coupled in parallel to the coil terminals. The bypass circuit is controlled on the basis of measurements of the field components to divert current from passing through the field coil. In this way, the magnetic fields of each of multiple field coils can be brought into mutual uniformity.
    Type: Application
    Filed: March 1, 2021
    Publication date: January 11, 2024
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Alexey RADOVINSKY, Robert MUMGAARD, Theodore GOLFINOPOULOS
  • Patent number: 11810712
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: November 7, 2023
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20230282400
    Abstract: A method includes inserting a high temperature superconductor (HTS) cable into a groove of a support structure; and flowing a molten metal into the HTS cable while the HTS cable is in the groove. A magnet structure includes a support structure having a groove; and a high temperature superconductor (HTS) cable comprising a metal at least partially filling the HTS cable, the HTS cable being disposed in the groove.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 7, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Robert MUMGAARD
  • Publication number: 20230073419
    Abstract: Schemes are described for conductor and coolant placement in stacked-plate superconducting magnets, including arranging coolant channels and conducting channels within the plates on opposing faces. If the two types of channels are aligned with one another across the plate stacks, the plates may be stacked such that the cooling channel in one plate is adjacent to the conducting channel of the neighboring plate. By stacking a number of these plates, therefore, cooling may be supplied to each conducting channel through the cooling channels of each neighboring plate. Moreover, by aligning the two types of channels, the stacks of plates may have improved mechanical strength because mechanical load paths through the entire stack that do not pass through any of the channels may be created. This arrangement of channels may produce a very strong stack of plates that can withstand high Lorentz loads.
    Type: Application
    Filed: March 25, 2021
    Publication date: March 9, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Robert MUMGAARD, William BECK, Jeffrey DOODY
  • Publication number: 20220359111
    Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.
    Type: Application
    Filed: June 17, 2020
    Publication date: November 10, 2022
    Applicant: Massachusetts Institute of Technology
    Inventors: Daniel BRUNNER, Robert MUMGAARD
  • Publication number: 20220336130
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Patent number: 11417464
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: August 16, 2022
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20210313104
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 7, 2021
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 11094439
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 17, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20200402693
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: December 23, 2019
    Publication date: December 24, 2020
    Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Publication number: 20200402692
    Abstract: A system comprises a superconducting magnet comprising a coil of superconducting material. The coil includes two electrical terminals. The windings of the coil are separated by a metallic conductor. A control circuit is coupled to the two terminals to drive a current through the coil to charge the superconducting magnet and configured to provide a current through the coil that is sufficiently small to avoid a quenching effect of the superconducting magnet but also large enough to charge the magnet within a predetermined time period. A cooling structure is thermally coupled to the coil to remove heat caused by charging the superconducting magnet with the current to allow for the current to be sufficiently large to charge the magnet within the predetermined time period without causing the quenching effect.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 24, 2020
    Inventors: Daniel BRUNNER, Robert MUMGAARD
  • Publication number: 20200211744
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Inventors: Brian LABOMBARD, Robert GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU