Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Abstract: Methods and apparatus to execute a workload in an edge environment are disclosed. An example apparatus includes a node scheduler to accept a task from a workload scheduler, the task including a description of a workload and tokens, a workload executor to execute the workload, the node scheduler to access a result of execution of the workload and provide the result to the workload scheduler, and a controller to access the tokens and distribute at least one of the tokens to at least one provider, the provider to provide a resource to the apparatus to execute the workload.

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die module coupled to the package substrate. In an embodiment, the die module comprises a die and a chiplet coupled to the die. In an embodiment, the chiplet is coupled to the die with a hybrid bonding interconnect architecture.

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

Abstract: Apparatuses and methods for managing jitter resulting from processing through a network interface pipeline are disclosed. In embodiments, a network traffic scheduler annotates packets to be transmitted over a bandwidth-limited network connection with time relationship information to ensure downstream bandwidth limitations are not violated. Following processing through a network interface pipeline, a jitter shaper inspects the annotated time relationship information and pipeline-imposed delays and, by imposing a variable delay, reestablishes bandwidth-complaint time relationships based upon the annotated time relationship information and configured tolerances.

Abstract: Methods and apparatus to execute a workload in an edge environment are disclosed. An example apparatus includes a node scheduler to accept a task from a workload scheduler, the task including a description of a workload and tokens, a workload executor to execute the workload, the node scheduler to access a result of execution of the workload and provide the result to the workload scheduler, and a controller to access the tokens and distribute at least one of the tokens to at least one provider, the provider to provide a resource to the apparatus to execute the workload.

Abstract: Apparatuses and methods for managing jitter resulting from processing through a network interface pipeline are disclosed. In embodiments, a network traffic scheduler annotates packets to be transmitted over a bandwidth-limited network connection with time relationship information to ensure downstream bandwidth limitations are not violated. Following processing through a network interface pipeline, a jitter shaper inspects the annotated time relationship information and pipeline-imposed delays and, by imposing a variable delay, reestablishes bandwidth-complaint time relationships based upon the annotated time relationship information and configured tolerances.

Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.

Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.

Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.

Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.

Abstract: An axial lead connector assembly for an implantable medical device (IMD) facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.

Abstract: A network device comprises a plurality of lookup tables and a processor. Each of the plurality of lookup tables comprises a plurality of table inputs that are associated with a plurality of processor instructions. The processor is operative to perform a network operation on a packet of data comprising a plurality of protocol header fields at least in part by performing one or more lookup cycles. A lookup cycle comprises the addressing of one of the plurality of lookup tables with one of the plurality of table inputs and the performing of the processor instruction associated with that table input. At least one of the plurality of processor instructions in the plurality of lookup tables comprises an instruction directing that the content of one of the plurality of protocol header fields be read and that one of the plurality of lookup tables be addressed with that content as the table input.

Abstract: A network processor for determining one or more network operations to be performed on a packet of data in a network comprises processing circuitry and protocol indicator circuitry. The packet of data contains information populating a plurality of protocol header fields. Moreover, the protocol indicator circuitry comprises a plurality of memory elements, each memory element associated with a protocol header field in the plurality of protocol header fields. The processing circuitry determines the one or more network operations to be performed on the packet of data at least in part by addressing one or more lookup tables with the contents of a subset of the plurality of protocol header fields in the packet. This subset is determined by reference to the memory elements in the protocol indicator circuitry. Each memory element is capable of being programmed to indicate whether the associated protocol header field is to be utilized by the processing circuitry in addressing the one or more lookup tables.