Abstract: An electronics component cabinet cover test device includes a housing that defines a test apparatus provided with first and second openings. A cover member is mounted to one of the openings, and an air moving device is arranged in the test apparatus. The air moving device includes an air inlet and an air outlet and generates airflow within the test apparatus. A sensor capable of measuring a characteristic of the airflow is mounted within the test apparatus. An airflow impedance device mounted to the inlet or the outlet of the air moving device. The airflow impedance device is configured to simulate an airflow obstruction. A controller establishes a flow rate of air from the air moving device and receives airflow data corresponding to the characteristic of the airflow from the sensor to determine one of an acoustical performance characteristic and a thermal performance characteristic of the cover member.

Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.