Patents by Inventor Robert N. Chylak
Robert N. Chylak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240266318Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.Type: ApplicationFiled: April 2, 2024Publication date: August 8, 2024Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman, Robert N. Chylak
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Publication number: 20240063169Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.Type: ApplicationFiled: July 27, 2023Publication date: February 22, 2024Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman, Robert N. Chylak
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Patent number: 10312216Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: GrantFiled: February 26, 2018Date of Patent: June 4, 2019Assignee: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Patent number: 10297568Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.Type: GrantFiled: October 2, 2017Date of Patent: May 21, 2019Assignee: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Publication number: 20180182733Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: ApplicationFiled: February 26, 2018Publication date: June 28, 2018Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Patent number: 9905530Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: GrantFiled: March 3, 2017Date of Patent: February 27, 2018Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Publication number: 20180026006Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.Type: ApplicationFiled: October 2, 2017Publication date: January 25, 2018Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Patent number: 9780065Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.Type: GrantFiled: March 14, 2017Date of Patent: October 3, 2017Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Patent number: 9779965Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.Type: GrantFiled: March 13, 2017Date of Patent: October 3, 2017Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Publication number: 20170186724Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.Type: ApplicationFiled: March 14, 2017Publication date: June 29, 2017Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Publication number: 20170186627Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.Type: ApplicationFiled: March 13, 2017Publication date: June 29, 2017Inventors: Robert N. Chylak, Dominick A. DeAngelis, Horst Clauberg
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Publication number: 20170179072Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: ApplicationFiled: March 3, 2017Publication date: June 22, 2017Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Patent number: 9633981Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: GrantFiled: May 5, 2016Date of Patent: April 25, 2017Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Publication number: 20160254252Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: ApplicationFiled: May 5, 2016Publication date: September 1, 2016Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Patent number: 9362247Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: GrantFiled: August 10, 2015Date of Patent: June 7, 2016Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Publication number: 20150348951Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: ApplicationFiled: August 10, 2015Publication date: December 3, 2015Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Patent number: 9136240Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: GrantFiled: October 3, 2014Date of Patent: September 15, 2015Assignee: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis
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Publication number: 20150097285Abstract: A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.Type: ApplicationFiled: October 3, 2014Publication date: April 9, 2015Applicant: Kulicke and Soffa Industries, Inc.Inventors: Robert N. Chylak, Dominick A. DeAngelis