Abstract: Apparatus and methods are disclosed to allow independent control of stacked memory modules. In one embodiment, an apparatus may comprise first, second, and third modules, each of the first, second and third modules having a plurality of stacked memory dice, at least some of the plurality of stacked memory dice including a Chip Enable (CE) signal electrically accessible from a bottom surface of a corresponding module of the first, second and third modules. The apparatus may comprise a Package-on-Package (PoP) structure where the first, second and third modules are attached to one another such that an individual access to each CE signal associated with the PoP structure is provided from the bottom surface of the corresponding module.

Abstract: Various embodiments of apparatuses are disclosed to allow independent control of stacked modules. In one embodiment, an apparatus may include a plurality of stacked memory dice, with at least some of the plurality of stacked memory dice include a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the dice. Each of the stacked dice having the CE signal connection is controllable individually by a unique CE signal applied to the CE signal connection. Other apparatuses are disclosed.

Abstract: Various embodiments of apparatuses are disclosed to allow independent control of stacked modules. In one embodiment, an apparatus may include a plurality of stacked memory dice, with at least some of the plurality of stacked memory dice include a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the dice. Each of the stacked dice having the CE signal connection is controllable individually by a unique CE signal applied to the CE signal connection. Other apparatuses are disclosed.