Abstract: A method and structure for an electronic circuit test and repair apparatus includes both of at least one wiring analyzer to locate circuit shorts and a current source to provide current sufficient to attempt to remove any identified shorts.

Abstract: A flexible conductive sheet is disclosed. In an exemplary embodiment of the invention, the flexible sheet includes a polyimide base layer and a metallic layer formed in a grid pattern upon the base layer. Preferably, there are a plurality of metallic layers, formed upon the base layer, with at least one of the plurality of metallic layers formed in the grid pattern. The metallic layers further include an adhesion layer, the adhesion layer further comprising a chromium layer, applied upon the polyimide base layer, and a copper layer, formed upon the chromium layer. Finally, a nickel layer is formed upon the adhesion layer, and a gold layer is formed upon the nickel layer.

Abstract: A method and structure for an electronic circuit test and repair apparatus includes both of at least one wiring analyzer to locate circuit shorts and a current source to provide current sufficient to attempt to remove any identified shorts.

Abstract: A bed-of-nails type or needle-card type test probe has clusters of parallel buckling beams arranged in a spaced arrangement. The buckling beams are arranged and electrically connected within a cluster so that a contaminant, which may be on the device being tested, does not reduce the accuracy of the test measurements. In particular, the spacing of the buckling beams is such that multiple buckling beams are capable of contacting a single feature on an electronics package to be tested. The buckling beams deflect independently of each other in response to compressive force, and the buckling beams within a cluster are electrically connected in parallel to each other to define redundant, independent conductive paths through the buckling beams. In this way, if a contaminant prevents one of the buckling beams of the cluster from making electrical contact with the feature to be tested, the other one or more of the buckling beams of the cluster will make the required electrical connection.

Abstract: Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures in multilayer substrates, such as are employed in chip carrier packaging, so as to facilitate electrical testing for via to via alignment and interface layer alignment, and to enable the testing of conductive interface electrical integrity of multilayer electrical devices.

Abstract: A bed-of-nails type or needle-card type test probe has clusters of parallel buckling beams arranged in a spaced arrangement. The buckling beams are arranged and electrically connected within a cluster so that a contaminant, which may be on the device being tested, does not reduce the accuracy of the test measurements. In particular, the spacing of the buckling beams is such that multiple buckling beams are capable of contacting a single feature on an electronics package to be tested. The buckling beams deflect independently of each other in response to compressive force, and the buckling beams within a cluster are electrically connected in parallel to each other to define redundant, independent conductive paths through the buckling beams. In this way, if a contaminant prevents one of the buckling beams of the cluster from making electrical contact with the feature to be tested, the other one or more of the buckling beams of the cluster will make the required electrical connection.