Abstract: Apparatus and methods are disclosed to allow independent control of stacked memory modules. In one embodiment, an apparatus may comprise first, second, and third modules, each of the first, second and third modules having a plurality of stacked memory dice, at least some of the plurality of stacked memory dice including a Chip Enable (CE) signal electrically accessible from a bottom surface of a corresponding module of the first, second and third modules. The apparatus may comprise a Package-on-Package (PoP) structure where the first, second and third modules are attached to one another such that an individual access to each CE signal associated with the PoP structure is provided from the bottom surface of the corresponding module.

Abstract: A memory device having die-stacking modules that are interchangeable within a Package-on-Package (PoP) and provide separate Chip Enable (CE) signals for all memory die in the die-stacking modules.