Abstract: The phase mask comprises binary square wave gratings which deflect light away from the collecting aperture of the projection system and binary phase gratings which deflect the incident light into a fan of rays to fill the collecting aperture. In the transmissive regions, the mask consists of randomly-placed squares etched to a depth corresponding to a half wave retardation and filling approximately fifty percent of the area within the transmissive region. The "blocking" regions consist of a binary grating etched to the same depth as that of the transmissive region but having sufficiently high spatial frequency to deflect the incident light to points outside of the collecting aperture.

Abstract: The in situ process control system includes a full aperture sensor for observing the wafer through the optical train. A reference laser is provided and directed through the optical train to the wafer which partially reflects the reference beam back to an interferometer, with interference fringes being detected by the full aperture sensor. The interferometer provides a map of optical path difference before and during exposure which is then used by the control processor to monitor and control wafer warpage, aberration and distortions due to thermal effects and prior process steps. The reference laser may have multiple wavelengths to differentiate between the photoresist and the underlying layer on the wafer. Backscattered light from the wafer back through the optical train and the mask or mask plane is used to monitor exposure realtime.

Abstract: The illumination system for a semiconductor wafer stepper includes reflective elements within the projection optics of a primary mirror, a secondary mirror, a deformable mirror and a beamsplitter. The beamsplitter directs light reflected from the wafer surface back into an interferometer camera to provide depth of focus and aberration information to a computer which activates and selectively deforms the deformable mirror. Light, input from a mercury arc lamp or laser source, is projected either with an expanded or scanned beam through a reticle which is printed with the pattern to be transferred to the wafer. An interferometer is included to combine light reflected from the wafer surface with a portion of the incoming light at the beamsplitter. The interference pattern formed by that combination is used by the computer to provide realtime manipulation of focus errors, vibration and aberration by deformation of the deformable mirror.

Abstract: The imaging and illumination system with aspherization and aberration correction by phase steps includes two transparent phase plates within the optical train of a stepper illumination system. The first plate places each ray at the corrected position on the axial stigmatism plate to satisfy the sine condition. The second plate, which is the axial stigmatism plate, ensures that each ray of light focuses at the focal point. The aberration corrected light is reflected by a deformable mirror toward a secondary mirror, a primary mirror and finally onto a wafer to project a single field of large dimension. The secondary and primary mirrors provide aspherization by forming phase steps in the surfaces of the mirrors. The deformable mirror, to permit realtime correction of aberrations and manipulation of the beam for each field imaged by the system. A set of two-dimensional scanning mirrors is placed between the laser light source and a reticle containing to pattern which is to be transferred to the wafer.

Abstract: The deformable wafter chuck system includes a base with a recess having a diameter slightly smaller than the diameter of the wafer to be held. The base may have one or more orifices or channels running therethrough for distributing a vacuum to secure the wafer to the chuck, or it may have a plurality of clips attached at the rim of the chuck for holding the wafer. Attached to the chuck within the recess is a plurality of distortive actuators, such as piezoelectric crystals, which cause the wafer to be selectively deformed to assume arbitrary shapes, cancelling the warpage of the wafer to permit reduced distortion of the projected pattern. An interferometer system is included to combine light reflected from the wafer surface with a portion of incoming light modulated by a mask or reticle, thereby forming an interference pattern.

Abstract: A gaseous laser medium is photodissociated into an upper laser state by vacuum ultraviolet light from an electrically excited noble gas mixed with the laser medium. A gaseous laser medium, such as cyanogen bromide, is preferably resonantly excited by photodissociation by such vacuum ultraviolet light. CN particles in the B state undergo laser transition to the X state, producing radiation at about 4000A. Alternatively or additionally, a gaseous laser medium is excited to produce molecules, such as halogen molecules, particularly Br.sub.2, in an upper laser state whence they undergo transition by laser action to a weakly bound lower laser state that is rapidly depopulated.

Abstract: A high voltage switching system switches large load currents in short periods. Gas is contained within an envelope at a pressure of the order of magnitude of at least 0.1 atmosphere. The gas provides a relatively high electron drift velocity at a relatively low electric field strength. A pair of electrodes are spaced apart within the envelope and are connected to respective switch terminals for connecting to a load. The voltage gradient between the electrodes so spaced is insufficient at rated voltage to produce any substantial secondary ionization. The gas is ionized by a beam of high energy electrons introduced into the gas through the envelope. Means is provided for turning the beam on and off, thereby closing and opening the current path through the gas and effecting the switching of current through the load.