Patents by Inventor Robert Oberle
Robert Oberle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11151438Abstract: A micro radio frequency identification tag for use on an article, the micro radio frequency identification tag comprises a substrate having a first surface and a second surface, each surface including a width and a longitudinal length, the longitudinal length being greater than the width; a chip anchor having a first chip attachment pad and a second chip attachment pad; a radio frequency identification chip operatively retained on the first surface by the chip anchor; a component anchor having a first component attachment pad and a second component attachment pad; a passive component operatively retained on the first surface by the component anchor; a continuous planar antenna operatively retained on the second surface; a first conductive trace interconnect segment connected to the continuous planar antenna and the first chip attachment pad; a second conductive trace interconnect segment connected to the continuous planar antenna and the second chip attachment pad; a third conductive trace interconnect segmenType: GrantFiled: July 24, 2020Date of Patent: October 19, 2021Assignee: Vizinex LLCInventor: Robert Oberle
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Publication number: 20210027131Abstract: A micro radio frequency identification tag for use on an article, the micro radio frequency identification tag comprises a substrate having a first surface and a second surface, each surface including a width and a longitudinal length, the longitudinal length being greater than the width; a chip anchor having a first chip attachment pad and a second chip attachment pad; a radio frequency identification chip operatively retained on the first surface by the chip anchor; a component anchor having a first component attachment pad and a second component attachment pad; a passive component operatively retained on the first surface by the component anchor; a continuous planar antenna operatively retained on the second surface; a first conductive trace interconnect segment connected to the continuous planar antenna and the first chip attachment pad; a second conductive trace interconnect segment connected to the continuous planar antenna and the second chip attachment pad; a third conductive trace interconnect segmenType: ApplicationFiled: July 24, 2020Publication date: January 28, 2021Applicant: Vizinex LLCInventor: Robert Oberle
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Patent number: 8646695Abstract: A wearable RFID device is configured with a geometry and materials that allow an HF RFID system and a UHF RFID system to operate in close proximity to a human body and to each other with minimal impact on performance. An RFID device may have a three-dimensional, multi-planar UHF antenna incorporated into a dielectric core with an HF antenna, or a single-plane UHF antenna separated from an HF antenna by a rigid spacer. A conductive metal backplane is disposed adjacent the wearable RFID device to improve antenna performance when disposed in close proximity to an absorbing body, such as a human being.Type: GrantFiled: October 3, 2011Date of Patent: February 11, 2014Assignee: Disney Enterprises, Inc.Inventors: David Worrall, Ernest Martin, Robert Oberle, Tvrtko Barbaric, Vlatko Kolaric, Giuliano Manzi
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Publication number: 20120111950Abstract: A wearable RFID device is configured with a geometry and materials that allow an HF RFID system and a UHF RFID system to operate in close proximity to a human body and to each other with minimal impact on performance. An RFID device may have a three-dimensional, multi-planar UHF antenna incorporated into a dielectric core with an HF antenna, or a single-plane UHF antenna separated from an HF antenna by a rigid spacer. A conductive metal backplane is disposed adjacent the wearable RFID device to improve antenna performance when disposed in close proximity to an absorbing body, such as a human being.Type: ApplicationFiled: October 3, 2011Publication date: May 10, 2012Inventors: David Worrall, Ernest Martin, Robert Oberle, Tvrtko Barbaric, Vlatko Kolaric, Giuliano Manzi
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Publication number: 20070273605Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: ApplicationFiled: August 10, 2007Publication date: November 29, 2007Applicant: RCD TECHNOLOGY INC.Inventor: Robert Oberle
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Publication number: 20070125867Abstract: A tamper evident RFID circuit uses a fold section that forms a capacitive element when folded together.Type: ApplicationFiled: December 5, 2005Publication date: June 7, 2007Applicant: RCD Technology Corp.Inventor: Robert Oberle
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Publication number: 20070103379Abstract: A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.Type: ApplicationFiled: November 10, 2005Publication date: May 10, 2007Inventors: Sandra Garby, Robert Oberle
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Publication number: 20060205115Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.Type: ApplicationFiled: November 22, 2005Publication date: September 14, 2006Applicant: RCD Technology Corp.Inventor: Robert Oberle
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Publication number: 20060205113Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.Type: ApplicationFiled: March 14, 2005Publication date: September 14, 2006Applicant: RCD Technology Corp.Inventor: Robert Oberle
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Publication number: 20060028379Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: ApplicationFiled: August 11, 2005Publication date: February 9, 2006Applicant: RCD Technology Corp.Inventor: Robert Oberle
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Publication number: 20050253772Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: ApplicationFiled: July 26, 2005Publication date: November 17, 2005Applicant: RCD Technology Corp.Inventor: Robert Oberle
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Publication number: 20050078035Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: ApplicationFiled: August 24, 2004Publication date: April 14, 2005Applicant: RCD Technology, Inc.Inventor: Robert Oberle
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Publication number: 20050017727Abstract: A sensor can detect the presence of fluid by the changing of the response characteristics of an RLC circuit. A window in the sensor is used to position a short caused by the fluid.Type: ApplicationFiled: May 5, 2004Publication date: January 27, 2005Applicant: RCD Technology, Inc.Inventor: Robert Oberle
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Patent number: 6194692Abstract: An electric heating sheet (10) includes a heating element (16) formed of a first cured conductive coating disposed on a substrate (12). A pair of electrodes (18) may be disposed at opposite ends of the heating element (16) and in electrical contact therewith. The electrodes (18) may be formed of a second cured conductive coating and one or more elements for configuring current distribution throughout the heating element may also be provided. A first layer (20) formed of an electrically insulating material may be disposed over the electrodes (18) and the heating element (16). A method of manufacturing the heating sheet is also presented.Type: GrantFiled: October 2, 1998Date of Patent: February 27, 2001Assignee: Engelhard CorporationInventor: Robert Oberle