Patents by Inventor Robert P. Bryan

Robert P. Bryan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9317477
    Abstract: A computer program product corrects a detonation time from a ballistic table, based on the actual velocity of a projectile measured upon exit of the projectile from the gun tube. The computer program product transfers a 16-bit data stream, through a 16-bit to an 8-bit encoder, to a fuze controller implemented as an 8-bit platform, to provide precise timing adjustment to a fuze controller. The computer program product significantly improves the accuracy of detonation times for air burst mode. The encoder calculates the absolute truncated, square rooted, X, of the input time delay number, as well as the error correction number, Y. The encoder then transmits both numbers X and Y as an 8-bit data stream, optionally along with the parity data to the fuze controller.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: April 19, 2016
    Assignee: The United States of America as Represented by the Secretary of the Army
    Inventors: Lloyd D. Khuc, Barry Schwartz, Jason Cahayla, Triet La, Robert P. Bryan, John Geaney, Olivier Nguyen
  • Patent number: 7021836
    Abstract: An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array of optoelectronic devices having at least a first end; an array of optical elements having at least a first end; the first end of the array of optical elements optically aligned with the first end of the array of optoelectronic devices; an optical path extending from the first end of the array of optoelectronic devices and ending at a second end of the array of optical elements; and an attenuator in the optical path for attenuating the optical energy emitted from the array of optoelectronic devices. Alternatively, a conditioner may be adapted in the optical path for conditioning the optical energy emitted from the array of optoelectronic devices.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: April 4, 2006
    Assignee: Emcore Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Richard F. Carson, Robert P. Bryan, Edwin B. Duckett, III, Shanalyn Adair Kemme, Frederick B. McCormick, David W. Peterson
  • Patent number: 6905260
    Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: June 14, 2005
    Assignee: Emcore Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, III, Rachel Knudsen Giunta, Robert T. Mitchell, Frederick B. McCormick, David W. Peterson, Merideth A. Rising, Cathleen A. Reber, Bill H. Reysen
  • Patent number: 6867377
    Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: March 15, 2005
    Assignee: EMCORE Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Edwin B. Duckett, III, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Bill H. Reysen
  • Patent number: 6863444
    Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: March 8, 2005
    Assignee: EMCORE Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R.F. Baca, Robert P. Bryan, Richard F. Carson, Edwin B. Duckett, III, Frederick B. McCormick, Gregory V. Miller, David W. Peterson, Terrance T. Smith
  • Patent number: 6799902
    Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: October 5, 2004
    Assignee: Emcore Corporation
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R. F. Baca, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, III, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Cathleen A. Reber, Bill H. Reysen
  • Publication number: 20040141709
    Abstract: An attenuator or conditioner apparatus is provided that is used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus functions to attenuate or condition optical energy emitted from optoelectronic devices.
    Type: Application
    Filed: December 26, 2000
    Publication date: July 22, 2004
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Richard F. Carson, Robert P. Bryan, Edwin B. Duckett, Shanalyn Adair Kemme, Frederick B. McCormick, David W. Peterson
  • Patent number: 6645848
    Abstract: This invention relates to a method of improving the fabrication of etched semiconductor devices by using a patterned adhesion promoter layer over a hydrocarbon planarization material. More specifically, the present invention improves the bonding of a metal interconnect layer to a hydrocarbon planarization material, such as polyimide, by inserting an adhesion promotion layer, such as silicon nitride, between the hydrocarbon planarization material and the metal interconnect layer. A process for improving the fabrication of etched semiconductor devices, comprises the steps of: (1) depositing a hydrocarbon planarization material over a substrate; (2) depositing an adhesion promoter over the hydrocarbon planarization material; (3) defining a first mask and etching back the adhesion promoter so as to form an adhesion promoter pad over a portion of the hydrocarbon planarization material; and (4) depositing a first metal over the adhesion promoter pad.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: November 11, 2003
    Assignee: Emcore Corporation
    Inventors: John R. Joseph, Wenlin Luo, Kevin L. Lear, Robert P. Bryan
  • Publication number: 20030103735
    Abstract: A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser.
    Type: Application
    Filed: December 26, 2000
    Publication date: June 5, 2003
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, Rachel Knudsen Giunta, Robert T. Mitchell, Frederick B. McCormick, David W. Peterson, Merideth A. Rising, Cathleen A. Reber, Bill H. Reysen
  • Publication number: 20030075355
    Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.
    Type: Application
    Filed: December 26, 2000
    Publication date: April 24, 2003
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Edwin B. Duckett, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Bill H. Reysen
  • Publication number: 20030057363
    Abstract: An optical power control system is provided that may be used in connection with an optical transmitter, receiver or transceiver module. The optical power control system comprises: (1) an array of optoelectronic devices; (2) an array of optical elements; (3) the array of optical elements optically aligned to the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; (4) a light-receiving device; and (5) a reflector proximate to the array of optical elements, the reflector optically orientated with the array of optoelectronic devices and the light-receiving device such that some emission from at least one optoelectronic device is reflected on at least a portion of the light-receiving device. The optical elements may be optical fibers and may be packaged in a ferrule. The light-receiving device may be a photo-detector or a light pipe.
    Type: Application
    Filed: December 26, 2000
    Publication date: March 27, 2003
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Edwin B. Duckett, Shanalyn Adair Kemme, Frederick B. McCormick, John A. Nevers, David W. Peterson
  • Publication number: 20020182848
    Abstract: This invention relates to a method of improving the fabrication of etched semiconductor devices by using a patterned adhesion promoter layer over a hydrocarbon planarization material. More specifically, the present invention improves the bonding of a metal interconnect layer to a hydrocarbon planarization material, such as polyimide, by inserting an adhesion promotion layer, such as silicon nitride, between the hydrocarbon planarization material and the metal interconnect layer. A process for improving the fabrication of etched semiconductor devices, comprises the steps of: (1) depositing a hydrocarbon planarization material over a substrate; (2) depositing an adhesion promoter over the hydrocarbon planarization material; (3) defining a first mask and etching back the adhesion promoter so as to form an adhesion promoter pad over a portion of the hydrocarbon planarization material; and (4) depositing a first metal over the adhesion promoter pad.
    Type: Application
    Filed: June 1, 2001
    Publication date: December 5, 2002
    Inventors: John R. Joseph, Wenlin Luo, Kevin L. Lear, Robert P. Bryan
  • Publication number: 20020122636
    Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.
    Type: Application
    Filed: December 26, 2000
    Publication date: September 5, 2002
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Johnny R.F. Baca, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett, Frederick B. McCormick, David W. Peterson, Gary D. Peterson, Cathleen A. Reber, Bill H. Reysen
  • Publication number: 20020122637
    Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.
    Type: Application
    Filed: December 26, 2000
    Publication date: September 5, 2002
    Inventors: Gene R. Anderson, Marcelino G. Armendariz, Robert P. Bryan, Richard F. Carson, Dahwey Chu, Edwin B. Duckett., Frederick B. McCormick, Robert T. Mitchell, David W. Peterson, Bill H. Reysen
  • Patent number: 5976905
    Abstract: An array of infrared vertical cavity surface-emitting lasers (VCSELs) and method of manufacturing the same is disclosed which reduces device-to-device non-uniformity for VCSEL arrays manufactured using well-known vapor phase epitaxial processes. The method involves growing layers comprising a standard infrared VCSEL array using a vapor phase epitaxial process on a substrate which is mosoriented from the (100) plane in the {111}A direction by preferably between eight and twelve degrees or more.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: November 2, 1999
    Assignee: Cielo Communications, Inc.
    Inventors: Timothy M. Cockerill, Robert P. Bryan
  • Patent number: 5625636
    Abstract: A monolithically integrated optoelectronic device is provided which integrates a vertical cavity surface emitting laser and either a photosensitive or an electrosensitive device either as input or output to the vertical cavity surface emitting laser either in parallel or series connection. Both vertical and side-by-side arrangements are disclosed, and optical and electronic feedback means are provided. Arrays of these devices can be configured to enable optical computing and neural network applications.
    Type: Grant
    Filed: October 11, 1991
    Date of Patent: April 29, 1997
    Inventors: Robert P. Bryan, Peter Esherick, Jack L. Jewell, Kevin L. Lear, Gregory R. Olbright
  • Patent number: 5525810
    Abstract: A solid-state scanner for reading bar codes or projecting images is described. The scanner operates either in a reading mode or a calibrate mode using the same hardware. Use of two-dimensional array light sources minimizes the size of the semiconductor chips containing the light source arrays is provided. Use of oversampling or anamorphic optical systems increase tolerances to angular misorientations is also discussed. Used in conjunction with a mechanical scanning device, the scanner is capable of reading two-dimensional bar codes or generating two-dimensional images.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: June 11, 1996
    Assignee: Vixel Corporation
    Inventors: Jack L. Jewell, Robert P. Bryan, Winston S. Fu, Stan E. Swirhun, William E. Quinn
  • Patent number: 5526182
    Abstract: An optical memory system employing multiple reading/writing optical beams for simultaneously reading from or writing to multiple tracks of optical media to allow reading/writing of closely spaced adjacent tracks. Various optical elements and other means are incorporated to enable the beams as a group to remain focused and properly tracking as the beams as a group scan across the tracks. Means are also provided for modulating the beams to reduce crosstalk. Various optical elements and combinations of optical elements are provided to compensate for beam and system imperfections.
    Type: Grant
    Filed: February 17, 1993
    Date of Patent: June 11, 1996
    Assignee: Vixel Corporation
    Inventors: Jack L. Jewell, Boris J. Muchnik, Robert P. Bryan
  • Patent number: 5500540
    Abstract: A package and method for packaging optoelectronic or electronic components is provided in which multiple chip regions are packaged simultaneously prior to sectioning of the wafer into chips. The method and package allows micro-optic and other package elements to be integrated onto wafers on the same face as the optoelectronic or electronic devices without inhibiting the ability to make electrical contact to the devices. The package elements may be integrated to the wafer by material deposition, by spinning, or by physical mounting.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: March 19, 1996
    Assignee: Photonics Research Incorporated
    Inventors: Jack L. Jewell, William E. Quinn, Stan E. Swirhun, Robert P. Bryan
  • Patent number: 5428634
    Abstract: A vertical cavity surface emitting laser that emits visible radiation is built upon a substrate, then having mirrors, the first mirror on top of the substrate; both sets of mirrors being a distributed Bragg reflector of either dielectrics or other materials which affect the resistivity or of semiconductors, such that the structure within the mirror comprises a plurality of sets, each having a thickness of .lambda./2n where n is the index of refraction of each of the sets; each of the mirrors adjacent to spacers which are on either side of an optically active bulk or quantum well layer; and the spacers and the optically active layer are from one of the following material systems: In.sub.z (Al.sub.y Ga.sub.1-y).sub.1-z P, InAlGaAs, AlGaAs, InGaAs, or AlGaP/GaP, wherein the optically active region having a length equal to m .lambda./2n.sub.eff where m is an integer and n.sub.
    Type: Grant
    Filed: November 5, 1992
    Date of Patent: June 27, 1995
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Robert P. Bryan, Gregory R. Olbright, James A. Lott, Richard P. Schneider, Jr.