Patents by Inventor Robert P. Campbell

Robert P. Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959132
    Abstract: Methods and devices are provided for simultaneously amplifying a plurality of sample wells for a predetermined amount of amplification, detecting whether amplification has occurred in a first set of the wells, amplifying for an additional amount of amplification and detecting whether amplification has occurred in a second set of the wells. Methods are also provided for analyzing a target nucleic acid sequence using melt curves that were generated in a plurality of amplification cycles.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: April 16, 2024
    Assignee: BioFire Diagnostics, LLC
    Inventors: Randy P. Rasmussen, Robert John Crisp, Andrew Clinton Hemmert, Elizabeth Barker Campbell, Thomas Charles Robbins, David J. Eyre
  • Patent number: 11570894
    Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: January 31, 2023
    Assignee: Rockwell Collins, Inc.
    Inventors: James B. Mayfield, Robert P. Campbell, Jeffrey J. Deloy, John A. Bauer
  • Publication number: 20210360789
    Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 18, 2021
    Applicant: Rockwell Collins, Inc.
    Inventors: James B. Mayfield, Robert P. Campbell, Jeffrey J. Deloy, John A. Bauer
  • Patent number: 8220259
    Abstract: An actuator includes a shape memory element formed from a shape memory alloy. The shape memory element is configured such that the actuator is actuated by a change in shape of the shape memory element. The shape memory element may be maintained in a pre-actuated state that is advanced from its rest state, but which is not at its actuated state.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: July 17, 2012
    Assignee: Rockwell Collins, Inc.
    Inventors: David Wayne Cripe, Bryan S. McCoy, Ryan J. Legge, Gerard A. Woychik, Robert P. Campbell
  • Patent number: 8051656
    Abstract: A shape memory element (a structure formed from a shape memory alloy) includes an electrically conductive ferromagnetic material. The ferromagnetic material may be magnetostrictive. In some embodiments, the shape memory element is formed from a shape memory alloy core and has a cladding over the core that includes the ferromagnetic material. In other embodiments, the shape memory alloy may be selected to be ferromagnetic.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: November 8, 2011
    Assignee: Rockwell Collins, Inc.
    Inventors: David Wayne Cripe, Bryan S. McCoy, Ryan J. Legge, Gerard A. Woychik, Robert P. Campbell
  • Patent number: 6444958
    Abstract: Improved cooling is achieved in a cooking appliance having a burner box including an air inlet and at least one burner assembly disposed therein. A control box containing control electronics is located adjacent to the burner box. The control box is provided with an air inlet and an air outlet for permitting a flow of cooling air therethrough. Also provided is a fan for causing cooling air to pass through the control box. The burner box air inlet is positioned so that cooling air exiting the control box via the control box outlet enters the burner box via the burner box inlet. In one preferred embodiment, an inner box is disposed in the burner box so as to define a compartment into which the cooling air flows.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: September 3, 2002
    Assignee: general Electric Company
    Inventor: Robert P. Campbell
  • Patent number: 6339212
    Abstract: Improved cooling is achieved in a cooking appliance including a burner box having at least one burner assembly disposed therein. A control box containing control electronics is spaced below the burner box so that a gap is created between the burner box and the control box. A plurality of fins is formed on at least one wall of the control box for cooling the control electronics by natural convection.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: January 15, 2002
    Assignee: General Electric Company
    Inventor: Robert P. Campbell