Patents by Inventor Robert P. Cross

Robert P. Cross has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11840634
    Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: December 12, 2023
    Assignee: HENKEL AG & CO, KGaA
    Inventors: Robert P. Cross, Bahram Issari, Wenhua Zhang, Lynnette M. Hurlburt, Jiangbo Ouyang, Rudolf Oldenzijl, Inge van der Meulen
  • Patent number: 11814530
    Abstract: Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: November 14, 2023
    Assignee: HENKEL AG & CO, KGaA
    Inventors: Robert P. Cross, Wenhua Zhang, Zhan Yang, Jiangbo Ouyang, Yu Chen, Lynnette M. Hurlburt, Darel L. Gustafson
  • Publication number: 20230174823
    Abstract: A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 8, 2023
    Inventors: Puwei Liu, Robert P. Cross, Jiangbo Ouyang
  • Publication number: 20210340398
    Abstract: Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.
    Type: Application
    Filed: July 8, 2021
    Publication date: November 4, 2021
    Inventors: Robert P. CROSS, Wenhua ZHANG, Zhan YANG, Jiangbo OUYANG, Yu CHEN, Lynnette M. HURLBURT, Darel L. GUSTAFSON
  • Publication number: 20210332176
    Abstract: Curable compositions that undergo reaction induced phase separation of domains in cured matrix and provide beneficial physical and chemical properties and methods of use of such compositions. Curable compositions that undergo reaction induced phase separation of domains in cured matrix in response to a first set of curing conditions and the domains undergo a second reaction in response to a second set of curing conditions to improve the physical properties of the domains and the cured composition, such as improvements in glass transition temperature and thermal degradation.
    Type: Application
    Filed: July 8, 2021
    Publication date: October 28, 2021
    Inventors: Bahram Issari, Michael Paul Levandoski, Christina Despotopoulou, Tianzhi Zhang, Darel Gustafson, Robert P. Cross
  • Publication number: 20210324219
    Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Robert P. Cross, Bahram lssari, Wenhua Zhang, Lynnette M. Hurlburt, Jiangbo Ouyang, Rudolf Oldenzijl, Inge van der Meulen
  • Publication number: 20210206988
    Abstract: Disclosed herein are electrically conductive ink compositions with high conductivity at a low conductive filler loading, the composition comprising a polymer, a monomer, an initiator or catalyst and conductive filler flakes, optionally the composition can include conductive or non-conductive beads, wherein after cure the monomer and polymer each form a separate phase.
    Type: Application
    Filed: March 23, 2021
    Publication date: July 8, 2021
    Inventors: Yu CHEN, Wenhua Zhang, Darel Gustafson, Robert P. Cross
  • Patent number: 10005919
    Abstract: Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: June 26, 2018
    Assignee: Henkel IP & Holding GmbH
    Inventors: Matthew P. Burdzy, Dingsong Feng, Kevin J. Welch, Yanbing Wang, Robert P. Cross
  • Publication number: 20150210882
    Abstract: Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.
    Type: Application
    Filed: April 9, 2015
    Publication date: July 30, 2015
    Inventors: Matthew P. Burdzy, Dingsong Feng, Kevin J. Welch, Yanbing Wang, Robert P. Cross
  • Patent number: 8119746
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: February 21, 2012
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
  • Patent number: 8088851
    Abstract: The present invention provides curable poly(acrylate) compositions, cured reaction products of which demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids, such as transmission fluids and oil- and fuel-based fluids.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: January 3, 2012
    Assignee: Henkel Corporation
    Inventors: Chiu-Sing Lin, Qinyan Zhu, Robert P. Cross
  • Publication number: 20110133366
    Abstract: The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process.
    Type: Application
    Filed: August 5, 2010
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsie-Kun Chu, Debora E. Duch, Mathias E. Liistro, JR., Alfred A. DeCato, Anthony R. Horelik, James E. Lionberger, Gregory A. Krueger
  • Publication number: 20110115132
    Abstract: The present invention relates to a mold-in-place gasket forming assembly that includes a flange, a mold and an electromagnetic radiation filter for improved cycling. The present invention further relates to a mold-in-place gasketing process.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 19, 2011
    Applicant: Henkel Corporation
    Inventors: Matthew Peter Burdzy, Robert P. Cross
  • Patent number: 7790094
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: September 7, 2010
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Anthony R. Horelik, Robert P. Cross, Debora E. Duch, Alfred A. DeCato, James E. Lionberger
  • Publication number: 20090143554
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Application
    Filed: November 26, 2008
    Publication date: June 4, 2009
    Applicant: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
  • Publication number: 20080306208
    Abstract: The present invention relates to a method of preparing fast curing silicone RTV compositions by reacting an amino endcapped silicone with an isocyanato functionalized silane, and to compositions formed thereby. In particular, the present invention provides compositions which include silicones endcapped with silanes which contain ?-ureas.
    Type: Application
    Filed: November 16, 2006
    Publication date: December 11, 2008
    Applicants: Henkel Corporation, Henkel KGaA
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Robert P. Cross, Mathias E. Liistro, JR., David P. Dworak, Paul Borucki, Scott Senuta, Daniela Bathelt, Thomas Bachon
  • Patent number: 7452937
    Abstract: A room temperature vulcanizing silicone polymer composition including: a) as part of the silicone polymer, a segment including a silicone polymer of Formula (I): b) a finely-divided inorganic filler present in an amount of at least about 25% by weight of the total composition. Enhanced elongation ability is possessed by these compositions.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: November 18, 2008
    Assignee: Henkel Corporation
    Inventors: Robert P. Cross, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Alfred A. DeCato, Debora E. Duch, Bahram Issari
  • Publication number: 20080128955
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Application
    Filed: February 8, 2006
    Publication date: June 5, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsien-Kun Chu, Deboral E. Duch, Mathias E. Liistro, Alfred A. DeCato, Anthony R. Horelik, James E. Lioberber
  • Patent number: 6884314
    Abstract: The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 26, 2005
    Assignee: Henkel Corporation
    Inventors: Robert P. Cross, Lester D. Bennington
  • Patent number: 6864340
    Abstract: The present invention provides novel “hybrid” silyl-terminated polymers that contain at least two different reactive end-capping groups. The “hybrid” silyl-terminated polymers of the present invention are produced by a novel single multi-step end-capping reaction of at least one silanol-terminated polymer with at least two silanes in the presence of a catalyst.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: March 8, 2005
    Assignee: Henkel Corporation
    Inventors: Michael P. Levandoski, Robert P. Cross, Alfred A. DeCato, Heath L. Salvati