Abstract: A sequencing system for a printing press, the printing press having a plurality of print stations, each of the print stations for printing a respective portion of a design on an item with ink, the printing press also having a curing station for curing the printed ink, the sequencing system comprising a controller having random access memory for selecting one of the print stations, for selecting one of the print stations, for indexing the item to the selected print station, for determining whether the item is present at the selected print station, for actuating the selected print station to print the respective portion of the design on the item, determining completion of the actuation, for selecting one of the curing stations, for indexing the item to the selected curing station, for determining whether the item is present at the selected curing station, for actuating the selected curing station, and for determining completion of the curing operation.

Abstract: A sequencing system for a printing press, the printing press having a plurality of print stations, each of the print stations for printing a respective portion of a design on an item with ink, the printing press also having a curing station for curing the printed ink, the sequencing system comprising a controller having random access memory for selecting one of the print stations, for indexing the item to the selected print station, for determining whether the item is present at the selected print station, for actuating the selected print station to print the respective portion of the design on the item, for determining completion of the actuation, for selecting one of the curing stations, for indexing the item to the selected curing station, for determining whether the item is present at the selected curing station, for actuating the selected curing station, and for determining completion of the curing operation.

Abstract: A multi-chip carrier array in which the individual carriers are defined by two perpendicular sets of parallel scribe lines which bisect the major axes of a plurality of equally-spaced oblong perforations. At the point of intersection of any two perpendicular scribe lines, the major axes of two such perforations intersect and bisect the right angles formed by said two perpendicular scribe lines. All other oblong perforations have their major axes perpendicular to the scribe lines. On the bottom surface of the array, metallic solder pads are located at opposite ends of each oblong perforation, and conductive material from each pad extends to the top surface of the array. Trace conductors on the top surface can be connected to these pad extensions. The trace conductors, in turn, will be connected to various connection points on an IC chip mounted in the center of the top surface of an individual carrier.