Abstract: The present invention discloses a device for positioning a multi-planar or multi-leaded surface mount electronic component on a printed circuit board (PCB) during reflow soldering. By design this non-conductive device made of thermoplastic resins comprises a fence, having a cavity, wherein the electronic component is positioned relative to printed circuit board foot print contacts. Attached to the bottom surface of the fence is a pair of collapsible slotted pegs. These pegs extend vertically downward from the fence and are adapted to provide a snap-fit insertion and retention mechanism whereby the fence is held in place by inserting the collapsible pegs into holes in a printed circuit board. Thereafter, a pair of cantilever beams which are attached to the fence sidewalls and extend into the fence cavity, make contact with the electronic component. As the fence is inserted into the printed circuit board, the cantilever beams press and hold the electronic component in place during reflow soldering.