Patents by Inventor Robert P. Mikulka
Robert P. Mikulka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9935166Abstract: In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and within the device.Type: GrantFiled: March 15, 2013Date of Patent: April 3, 2018Assignee: QUALCOMM IncorporatedInventors: Je-Hsiung Lan, Chengjie Zuo, Changhan Yun, David F. Berdy, Daeik D. Kim, Robert P. Mikulka, Mario Francisco Velez, Jonghae Kim
-
Patent number: 9813043Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: GrantFiled: March 24, 2016Date of Patent: November 7, 2017Assignee: QUALCOMM IncorporatedInventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Patent number: 9634640Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: GrantFiled: May 6, 2013Date of Patent: April 25, 2017Assignee: QUALCOMM IncorporatedInventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Patent number: 9401689Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: GrantFiled: May 6, 2013Date of Patent: July 26, 2016Assignee: QUALCOMM IncorporatedInventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Publication number: 20160204758Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: ApplicationFiled: March 24, 2016Publication date: July 14, 2016Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Patent number: 9331665Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: GrantFiled: May 6, 2013Date of Patent: May 3, 2016Assignee: QUALCOMM IncorporatedInventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Patent number: 9203373Abstract: A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.Type: GrantFiled: March 13, 2013Date of Patent: December 1, 2015Assignee: QUALCOMM IncorporatedInventors: Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Daeik D. Kim, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Publication number: 20150035162Abstract: An inductive device that includes a conductive via and a metal layer are disclosed. A particular method of forming an electronic device includes forming a metal layer that contacts a surface of a substrate. The substrate, including the surface, is formed from a substantially uniform dielectric material. The metal layer contacts a conductive via that extends at least partially within the substrate. The metal layer and the conductive via form at least a portion of an inductive device.Type: ApplicationFiled: August 2, 2013Publication date: February 5, 2015Applicant: QUALCOMM IncorporatedInventors: Je-Hsiung Lan, Chengjie Zuo, Mario Francisco Velez, Daeik D. Kim, David F. Berdy, Changhan Yun, Robert P. Mikulka, Jonghae Kim, Matthew M. Nowak
-
Publication number: 20140354372Abstract: Systems for reducing magnetic coupling in integrated circuits (ICs) are disclosed. Related components and methods are also disclosed. The ICs have a plurality of inductors. Each inductor generates a magnetic flux that has a discernible axis. To reduce magnetic coupling between the inductors, the flux axes are designed so as to be non-parallel. In particular, by making the flux axes of the inductors non-parallel to one another, magnetic coupling between the inductors is reduced relative to the situation where the flux axes are parallel. This arrangement may be particularly well suited for use in diplexers having a low pass and a high pass filter.Type: ApplicationFiled: September 6, 2013Publication date: December 4, 2014Applicant: QUALCOMM IncorporatedInventors: Chengjie Zuo, Jonghae Kim, Daeik D. Kim, Mario Francisco Velez, Changhan Yun, Je-Hsiung Lan, Robert P. Mikulka, Matthew M. Nowak
-
Publication number: 20140327496Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.Type: ApplicationFiled: May 6, 2013Publication date: November 6, 2014Applicant: QUALCOMM IncorporatedInventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
-
Publication number: 20140327508Abstract: An inductor tunable by a variable magnetic flux density component is disclosed. A particular device includes an inductor. The device further includes a variable magnetic flux density component (VMFDC) positioned to influence a magnetic field of the inductor when a current is applied to the inductor.Type: ApplicationFiled: May 6, 2013Publication date: November 6, 2014Applicant: Qualcomm IncorporatedInventors: Daeik D. Kim, Kangho Lee, David F. Berdy, Mario Francisco Velez, Jonghae Kim, Je-Hsiung Lan, Changhan Yun, Niranjan Sunil Mudakatte, Robert P. Mikulka
-
Publication number: 20140327510Abstract: An electronic device includes a structure. The structure includes a first set of through glass vias (TGVs) and a second set of TGVs. The first set of TGVs includes a first via and the second set of TGVs includes a second via. The first via has a different cross-sectional shape than the second via.Type: ApplicationFiled: May 6, 2013Publication date: November 6, 2014Applicant: QUALCOMM IncorporatedInventors: Daeik D. Kim, David F. Berdy, Chengjie Zuo, Mario Francisco Velez, Changhan Yun, Robert P. Mikulka, Jonghae Kim, Je-Hsiung Lan
-
Publication number: 20140268616Abstract: In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and within the device.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: QUALCOMM INCORPORATEDInventors: Je-Hsiung Lan, Chengjie Zuo, Changhan Yun, David F. Berdy, Daeik D. Kim, Robert P. Mikulka, Mario Francisco Velez, Jonghae Kim
-
Publication number: 20140197902Abstract: A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.Type: ApplicationFiled: March 13, 2013Publication date: July 17, 2014Applicant: QUALCOMM INCORPORATEDInventors: Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Daeik D. Kim, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See