Patents by Inventor Robert P. Molfino

Robert P. Molfino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nano-tube thermal interface structure
    Patent number: 8809208
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: August 19, 2014
    Assignee: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • NANO-TUBE THERMAL INTERFACE STRUCTURE
    Publication number: 20120094484
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Application
    Filed: December 28, 2011
    Publication date: April 19, 2012
    Applicant: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • Nano-tube thermal interface structure
    Patent number: 8106510
    Abstract: A semiconductor structure having: an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: January 31, 2012
    Assignee: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • NANO-TUBE THERMAL INTERFACE STRUCTURE
    Publication number: 20110032678
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 10, 2011
    Applicant: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield