Abstract: A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.

Abstract: The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.

Abstract: A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.