Patents by Inventor Robert Patrick Maloney

Robert Patrick Maloney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10056670
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 21, 2018
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Publication number: 20160006100
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Application
    Filed: September 18, 2015
    Publication date: January 7, 2016
    Inventors: MICHAEL RAYMOND WEATHERSPOON, LOUIS JOSEPH RENDEK, JR., LAWRENCE WAYNE SHACKLETTE, ROBERT PATRICK MALONEY, DAVID M. SMITH
  • Patent number: 9159485
    Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: October 13, 2015
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Patent number: 9142497
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: September 22, 2015
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Publication number: 20130335183
    Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
    Type: Application
    Filed: August 21, 2013
    Publication date: December 19, 2013
    Applicant: Harris Corporation
    Inventors: MICHAEL RAYMOND WEATHERSPOON, LOUIS JOSEPH RENDEK, JR., LAWRENCE WAYNE SHACKLETTE, ROBERT PATRICK MALONEY, DAVID M. SMITH
  • Patent number: 8539666
    Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: September 24, 2013
    Assignee: Harris Corporation
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Publication number: 20130120095
    Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
    Type: Application
    Filed: November 10, 2011
    Publication date: May 16, 2013
    Applicant: Harris Corporation
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, JR., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Publication number: 20130087365
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 11, 2013
    Applicant: Harris Corporation
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, JR., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
  • Patent number: 7495629
    Abstract: A microstrip slot dipole antenna of the inverted F type, includes a coplanar feed, and is suitable for easy peel-and-stick adhesive mounting. The antenna includes a ground plane, a dielectric layer, a horizontal element and a pair of spaced apart vertical elements depending therefrom defining an inverted F antenna above the ground plane with the dielectric layer therebetween. The pair of vertical elements may be conductive vias. A first antenna feed point is on an upper surface of the horizontal element, and a second antenna feed point is on an upper surface of a second vertical element of the spaced apart vertical elements. The second feed point may be a conductive pad on the dielectric layer spaced apart from a first vertical element and insulated from the horizontal element.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: February 24, 2009
    Assignee: Harris Corporation
    Inventors: Francis Eugene Parsche, Robert Patrick Maloney, Robert Nathan Lavallee
  • Patent number: 7286095
    Abstract: The discone antenna includes a conical antenna element, having an apex, and a disc antenna element adjacent the apex of the conical antenna element. An inverted antenna feed structure, such as a flanged coaxial connector or coaxial cable, is connected to the disc and conical antenna elements and extends outwardly from the disc antenna element on a side thereof opposite the apex of the conical antenna element. The discone antenna with such an inverted feed structure facilitates an inverted positioning, for example, on vehicles, rooftops and/or control towers, etc., that will increase the bandwidth pattern in the direction of the potential target.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: October 23, 2007
    Assignee: Harris Corporation
    Inventors: Francis Eugene Parsche, Robert Patrick Maloney, Robert Nathan Lavallee