Patents by Inventor Robert Patukonis

Robert Patukonis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer board switch matrix
    Patent number: 7193487
    Abstract: A multi-layer cross connect having high isolation between signal channels, the multi-layer cross connect comprising: (a) a multi-layer circuit board having a top and bottom orientation and comprising at least a bottom layer and one or more upper layers; (b) a plurality of microstrip launches along the perimeter of the bottom layer; (c) a plurality of striplines on the bottom layer, each stripline being connected to one and only one microstrip launch and comprising a transformer for lowering its impedance and thereby increasing its width, the striplines comprising first striplines and second striplines; (d) a plurality of transition vias, each transition via conductively coupling each of the second striplines to a stripline on an upper layer; and (e) a combiner on each layer for combining signals from multiple striplines to a common stripline.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: March 20, 2007
    Assignee: M/A-Com, Inc.
    Inventors: Jay Alexander, Anthony Cappello, Raymond Kaarsberg, Robert Patukonis
  • Multilayer board switch matrix
    Publication number: 20060139119
    Abstract: A multi-layer cross connect having high isolation between signal channels, the multi-layer cross connect comprising: (a) a multi-layer circuit board having a top and bottom orientation and comprising at least a bottom layer and one or more upper layers; (b) a plurality of microstrip launches along the perimeter of the bottom layer; (c) a plurality of striplines on the bottom layer, each stripline being connected to one and only one microstrip launch and comprising a transformer for lowering its impedance and thereby increasing its width, the striplines comprising first striplines and second striplines; (d) a plurality of transition vias, each transition via conductively coupling each of the second striplines to a stripline on an upper layer; and (e) a combiner on each layer for combining signals from multiple striplines to a common stripline.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Applicant: Tyco Electronics Corporation
    Inventors: Jay Alexander, Anthony Cappello, Raymond Kaarsberg, Robert Patukonis