Patents by Inventor Robert Pellacani

Robert Pellacani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8416566
    Abstract: An input/output panel for use with a server chassis may comprise a cover, an input/output interface circuit board, a plurality of interfaces, and a ground clip. The cover of non-conductive plastic may be configured to mount to a rear cover of the server chassis. The input/output interface circuit board may be disposed on a first side of the cover. The plurality of interfaces may be disposed on the input/output interface circuit board and extend at least partially through the cover to the second side of the cover. The ground clip may include a conductive component partially disposed within the plastic cover. A first end of the ground clip may extend from the first side of the cover and be configured to mate with the input/output interface circuit board. A second end of the ground clip may extend from the first side of cover and be configured to mate with a ground circuit associated with the rear cover of the server chassis.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: April 9, 2013
    Assignee: Fujitsu Limited
    Inventors: Leonard R. Renkel, Jr., Robert Pellacani, Corey Dayton, Willie Braun, Larry Fox, Mahesh Mistry
  • Publication number: 20120008285
    Abstract: An input/output panel for use with a server chassis may comprise a cover, an input/output interface circuit board, a plurality of interfaces, and a ground clip. The cover of non-conductive plastic may be configured to mount to a rear cover of the server chassis. The input/output interface circuit board may be disposed on a first side of the cover. The plurality of interfaces may be disposed on the input/output interface circuit board and extend at least partially through the cover to the second side of the cover. The ground clip may include a conductive component partially disposed within the plastic cover. A first end of the ground clip may extend from the first side of the cover and be configured to mate with the input/output interface circuit board. A second end of the ground clip may extend from the first side of cover and be configured to mate with a ground circuit associated with the rear cover of the server chassis.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 12, 2012
    Inventors: Leonard R. Renkel, JR., Robert Pellacani, Corey Dayton, Willie Braun, Larry Fox, Mahesh Mistry