Patents by Inventor Robert Pressl

Robert Pressl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip
    Patent number: 10522432
    Abstract: According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the first surface; a capacitive structure for detecting crack propagation into the semiconductor body region; wherein the capacitive structure may include a first electrode region at least partially surrounding the semiconductor body region and at least substantially extending from the first surface to the second surface; wherein the capacitive structure further may include a second electrode region disposed next to the first electrode region and an electrically insulating region extending between the first electrode region and the second electrode region.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: December 31, 2019
    Assignee: Infineon Technologies AG
    Inventors: Herbert Gietler, Robert Pressl
  • SEMICONDUCTOR CHIP
    Publication number: 20170133289
    Abstract: According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the first surface; a capacitive structure for detecting crack propagation into the semiconductor body region; wherein the capacitive structure may include a first electrode region at least partially surrounding the semiconductor body region and at least substantially extending from the first surface to the second surface; wherein the capacitive structure further may include a second electrode region disposed next to the first electrode region and an electrically insulating region extending between the first electrode region and the second electrode region.
    Type: Application
    Filed: January 24, 2017
    Publication date: May 11, 2017
    Inventors: Herbert Gietler, Robert Pressl
  • Semiconductor chip
    Patent number: 9589914
    Abstract: According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the first surface; a capacitive structure for detecting crack propagation into the semiconductor body region; wherein the capacitive structure may include a first electrode region at least partially surrounding the semiconductor body region and at least substantially extending from the first surface to the second surface; wherein the capacitive structure further may include a second electrode region disposed next to the first electrode region and an electrically insulating region extending between the first electrode region and the second electrode region.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: March 7, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Herbert Gietler, Robert Pressl
  • SEMICONDUCTOR CHIP
    Publication number: 20160155712
    Abstract: According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the first surface; a capacitive structure for detecting crack propagation into the semiconductor body region; wherein the capacitive structure may include a first electrode region at least partially surrounding the semiconductor body region and at least substantially extending from the first surface to the second surface; wherein the capacitive structure further may include a second electrode region disposed next to the first electrode region and an electrically insulating region extending between the first electrode region and the second electrode region.
    Type: Application
    Filed: November 28, 2014
    Publication date: June 2, 2016
    Inventors: Herbert Gietler, Robert Pressl