Abstract: Disclosed herein is an improved relay for replacing an electro-mechanical relay and converting the original electro-mechanical relay to a solid state relay. The improved relay includes a housing module having an interior. The interior includes a plurality of existing relay tabs and wires. The wires electrically connect the tabs to a connection member. The invention also includes a solid state relay member having a solid state relay module. The module includes a plurality of solid state relay contacts, each corresponding to the existing tabs. The plurality of solid state relay contacts are mounted on, for example, a PC board and adapted for connection to the housing module connection member. Additionally, the existing relay includes a power tab and the wires and connection member are adapted to provide power to the solid relay module for powering each of the solid state relay contacts.