Abstract: An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.

Abstract: An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.

Abstract: Formation of a contact probe having a pattern of dendritic textured contacts complementary to that of a contact pad array on a bare chip allows formation of simultaneous temporary connections to all contact pads of the bare chip at a much reduced compressional force across the chip. The reliability of such connections at such a reduced force allows screening, burn-in and full functional testing of the bare chip at a high throughput by an automated apparatus to exploit potential economies of "known good die" (KGD) processing for limiting or avoiding repair, rework and further processing of less than fully functional chips for complex electronic packages. The compressional force is sensed by a pressure sensor, the output of which controls the advancement of the bare chip toward the contact probe such that the dendritic textured contacts of the contact probe penetrate the contact pads of the bare chip.