Abstract: A hearing aid is enclosed in a gas-impermeable or substantially gas-impermeable package to prevent inadvertent activation of the hearing aid during transport. The package may include a housing having a groove that substantially conforms to at least a portion of the shape of the hearing aid to snugly hold the hearing aid. The groove may be substantially open adjacent a switch on the hearing aid. A securing member, such as a strap, may be used to immobilize the switch relative to the housing.

Abstract: A disposable hearing aid insertable into an ear canal which includes a microphone which translates acoustic energy into electrical signals, signal processing circuitry which processes the electrical signals provided by the microphone, a receiver which converts the processed electrical signals into acoustic energy, and a power source permanently disposed within the hearing aid such that the source is substantially non-removeably integrated with the hearing aid.

Abstract: A hearing aid insertable into an ear canal includes a microphone which translates acoustic energy into electrical signals, signal processing circuitry which processes the electrical signals provided by the microphone, a receiver which converts the processed electrical signals into acoustic energy, and a power source connectable to the signal processing circuitry.

Abstract: A hearing aid insertable into an ear canal includes a microphone which translates acoustic energy into electrical signals, signal processing circuitry which processes the electrical signals provided by the microphone, a receiver which converts the processed electrical signals into acoustic energy, and a power source connectable to the signal processing circuitry.

Abstract: A disposable hearing aid insertable into an ear canal which includes a microphone which translates acoustic energy into electrical signals, signal processing circuitry which processes the electrical signals provided by the microphone, a receiver which converts the processed electrical signals into acoustic energy, and a power source permanently disposed within the hearing aid such that the source is substantially non-removeably integrated with the hearing aid.

Abstract: The present invention provides a liquid distribution system, which is useful in a number of contexts, including in accomplishing various synthetic, diagnostic and drug screening reactions. The distribution system can comprise an alpha reservoir and a beta reservoir, a first set of parallel and adjacent first and second feeder channels and a second set of parallel and adjacent third and fourth feeder channels which are offset from the first and second feeder channels, wherein (a) the first and third feeder channels are connected to the alpha reservoir via a first connector channel that is situated above or below the second and fourth feeder channels and are independent of the beta reservoir and (b) the second and fourth feeder channels are connected to the beta reservoir via a second connector channel that is situated above or below the first and third feeder channels and are independent of the alpha reservoir. The distribution system is preferably a microscale distribution system.

Abstract: The present invention provides a method of forming a fluidtight electrical conduit through a high aspect ratio hole, the method comprising sintering a via ink to form the electrical conduit and to seal the hole.

Abstract: A system and method for accomplishing a plurality of combinatorial processes in parallel comprising a microelectronic and fluidic array (device array) having micron-sized reservoirs, connecting microchannels and reaction cells etched into a substrate. The device array is supported by a station which serves to interface and perform electro-optic measurements of material in the reaction cells of the device array. The device array incorporates a modular configuration with three distinct layers or plates. The device array comprises a top feedthru plate, a center distribution plate and a bottom cell plate. The three plates are stacked vertically and coupled together to form a liquid-tight seal. Reservoirs, microchannels and reactions cells are controllably etched onto the plates using traditional semiconductor fabrication techniques. The top feedthru plate serves as a cover for the device array and contains apertures selectively positioned above the reservoirs located in the center distribution plate.

Abstract: A chip package for an IC chip having at least an optical-signal input or output section comprises a container-like chip carrier for carrying the IC chip, a sealing cover bonded to the chip carrier and having a window for the optical-signal section, and a connector plate holding a plurality of optical signal transmission elements which are used to transmit a plurality of optical signals en bloc so that optical signals are input to or output from the optical-signal section through the window on the cover. The chip carrier and the connector plate are securely attached to a circuit board in the state where the connector plate has been separately positioned in a predetermined spatial relationship with the chip carrier.

Abstract: A pair of locating washers are applied over the holes in the bottom mounting lugs of the kinescope. The washers have apertures which are precisely referenced with respect to the position of the kinescope screen by using a pair of oppositely-disposed screen locating marks. The TV cabinet, on the other hand, is equipped with a pair of tapered guiding posts on the inside front surfaces thereof, which are similarly referenced relative to the rectangular opening of the cabinet. When the kinescope is loaded into the cabinet, the cabinet guiding posts are received into the kinescope-mounted locating washers to assure registration between the kinescope screen and the cabinet opening. The kinescope is fixedly secured to the cabinet by a plurality of screws.

Abstract: The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the blade and by slightly retracting the face of the ingot from the plane of the saw blade. A fluid-jet-induced deformation of the binding compound portion of the ingot is preferred as a means of leaning the wafer away from the saw blade. Using this technique a number of wafers may be successively sawn from an ingot and kept attached to the ingot by the binding compound without the surfaces of the wafers being scored during the return strokes of the blade.

Abstract: The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the blade and by slightly retracting the face of the ingot from the plane of the saw blade. A fluid-jet-induced deformation of the binding compound portion of the ingot is preferred as a means of leaning the wafer away from the saw blade. Using this technique a number of wafers may be successively sawn from an ingot and kept attached to the ingot by the binding compound without the surfaces of the wafers being scored during the return strokes of the blade.

Abstract: A system for controlling the blade-to-boule feedrate of a wafer cutting saw to regulate the blade-to-boule force in accordance with predetermined criteria and for monitoring the cutting efficiency of the blade and determining when the blade needs to be dressed to increase its cutting efficiency. A constant blade-to-boule force is preferred.

Abstract: The quality of the as-sawn surfaces of a wafer is improved by preventing the saw blade from striking the wafer surfaces during the blade return stroke by leaning the just-sawn wafer away from the blade and by slightly retracting the face of the ingot from the plane of the saw blade. A fluid-jet-induced deformation of the binding compound portion of the ingot is preferred as a means of leaning the wafer away from the saw blade. Using this technique a number of wafers may be successively sawn from an ingot and kept attached to the ingot by the binding compound without the surfaces of the wafers being scored during the return strokes of the blade.