Abstract: A composition that comprises a photopolymerizable compound containing at least two pendant unsaturated groups; at least one ethylenically unsaturated photopolymerizable polyalkylene oxide hydrophilic monomer; at least one nonionic surfactant; and at least one photoinitiator is provided. The composition also preferably contains at least one amine modified acrylic oligomer and a dye. Other conventional photoresist components such as photosensitizers, adhesion promoters, leveling agents and solvents may also be included in the composition. Such compositions are useful for forming a pattern on a substrate, such as patterning microlithographic circuits on a substrate.

Abstract: Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.

Abstract: Disclosed is a photoresist composition comprising: a) at least one film forming resin selected from the group consisting of novolak resins, and polyhydroxystyrenes; b) at least one photoactive compound or photoacid generator; and c) a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a photoresist composition comprising a polycarbonate resin and a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a process for imaging a photoresist composition, comprising the steps of: a) coating a suitable substrate with any of the aforementioned photoresist compositions; b) baking the substrate to substantially remove the solvent; c) imagewise irradiating the photoresist film; and d) removing the imagewise exposed or, alternatively, the unexposed areas of the coated substrate with a suitable developer.

Abstract: A composition that comprises a photopolymerizable compound containing at least two pendant unsaturated groups; at least one ethylenically unsaturated photopolymerizable polyalkylene oxide hydrophilic monomer; at least one nonionic surfactant; and at least one photoinitiator is provided. The composition also preferably contains at least one amine modified acrylic oligomer and a dye. Other conventional photoresist components such as photosensitizers, adhesion promoters, leveling agents and solvents may also be included in the composition. Such compositions are useful for forming a pattern on a substrate, such as patterning microlithographic circuits on a substrate.

Abstract: Disclosed is a photoresist composition comprising: a) at least one film forming resin selected from the group consisting of novolak resins, and polyhydroxystyrenes; b) at least one photoactive compound or photoacid generator; and c) a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a photoresist composition comprising a polycarbonate resin and a solvent composition comprising at least one solvent selected from the group consisting of acetals and ketals. Also disclosed is a process for imaging a photoresist composition, comprising the steps of: a) coating a suitable substrate with any of the aforementioned photoresist compositions; b) baking the substrate to substantially remove the solvent; c) imagewise irradiating the photoresist film; and d) removing the imagewise exposed or, alternatively, the unexposed areas of the coated substrate with a suitable developer.

Abstract: Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.