Abstract: The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including trivalent chromium ions, and formate anions and/or oxalate anions as complexing agents for said trivalent chromium ions, in which the trivalent chromium ions with respect to all formate anions together with all oxalate anions form a molar ratio in the range from 1:15 to 1:400.

Abstract: The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including trivalent chromium ions, and formate anions and/or oxalate anions as complexing agents for said trivalent chromium ions, in which the trivalent chromium ions with respect to all formate anions together with all oxalate anions form a molar ratio in the range from 1:15 to 1:400.

Abstract: A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising the surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with the passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto the surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.

Abstract: The present invention relates to a method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising said surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with said passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto said surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.

Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.

Abstract: A water-based composition for post-treatment of metal surfaces, preferably a silver or silver alloy surface, including: an alkanethiol an anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant with a HLB value of 12 to 18, a compound of the general formula I: wherein R1 is —H, —CH3, —C2H5, —(C2H4O)p—H, —(C2H4O)p—CH3, —(C2H4O)p—CH(CH3)2, —(C2H4)p—C(CH3)3, wherein p is 1 to 20, R2 is H, or CH3 n is an integer in the range of 0 to 3, m is an integer in the range of 0 to 2.

Abstract: The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.

Abstract: The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, and (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: The present invention relates to aqueous post-treatment compositions and an immersion and/or electrolytical process using said compositions for corrosion protection of metal and/or metal alloy surfaces. The aqueous post-treatment compositions comprise at least one polysiloxane betaine compound and at least one phosphorus containing compound.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: The electromagnetic coil according to the invention has a coil core, a winding of coil wire and two contact pins, the contact pins being secured to at least one resilient holding member and being movable relative to the coil core. The holding member is formed in a unitary manner with the coil core, and the ends of the coil wire are secured to the movable/resilient contact pins.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Abstract: Stable, electroless, aqueous acidic gold bath, containing the tetracyano-(III) anion, a complexing agent, or a mixture of several complexing agents, and an acid, or a mixture of acids, and the use of these baths for the deposition of gold on metals which are less noble than gold or on alloys of these metals.