Abstract: A wafer bonding method includes placing a first wafer on a first bonding framework including a plurality of outlet holes around a periphery of the first bonding framework. A second wafer is placed on a second bonding framework that includes a plurality of inlet holes around a periphery of the second bonding framework. The first bonding framework is in overlapping relation to the second bonding framework such that a gap exist between the first wafer and the second wafer. A gas stream is circulated through the gap between the first wafer and the second wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the first wafer and the second wafer.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: A wafer bonding method includes placing a first wafer on a first bonding framework including a plurality of outlet holes around a periphery of the first bonding framework. A second wafer is placed on a second bonding framework that includes a plurality of inlet holes around a periphery of the second bonding framework. The first bonding framework is in overlapping relation to the second bonding framework such that a gap exist between the first wafer and the second wafer. A gas stream is circulated through the gap between the first wafer and the second wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the first wafer and the second wafer.

Abstract: A method is presented for cleaning an ion implanter during operation of the ion implanter. The method includes generating a gallium (III) iodide (GaI3) vapor from a GaI3 source running concurrently with a hydrogen-containing gaseous plasma to cause a reaction with at least iodine (I) residue deposits, selectively filtering ions from the GaI3 vapor and the hydrogen-containing gaseous plasms to create a Ga ion beam, and directing the Ga ion beam onto a semiconductor substrate for Ga implantation. After completion of the Ga implantation, an argon (Ar) based ion beam is run through the ion implanter for post-cleaning of the ion implanter.

Abstract: A method is presented for cleaning an ion implanter during operation of the ion implanter. The method includes generating a gallium (III) iodide (GaI3) vapor from a GaI3 source running concurrently with a hydrogen-containing gaseous plasma to cause a reaction with at least iodine (I) residue deposits, selectively filtering ions from the GaI3 vapor and the hydrogen-containing gaseous plasms to create a Ga ion beam, and directing the Ga ion beam onto a semiconductor substrate for Ga implantation. After completion of the Ga implantation, an argon (Ar) based ion beam is run through the ion implanter for post-cleaning of the ion implanter.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.

Abstract: An apparatus for implementing an emergency machine off circuit of a fabrication system, includes: at least one safety switch adapted for shunting an operation enable signal from a piece of equipment selected for removal from service, the switch also removing from service supplemental devices for the selected equipment. A semiconductor fabrication system and a method for removing equipment from service are provided.

Abstract: An apparatus for implementing an emergency machine off circuit of a fabrication system, includes: at least one safety switch adapted for shunting an operation enable signal from a piece of equipment selected for removal from service, the switch also removing from service supplemental devices for the selected equipment. A semiconductor fabrication system and a method for removing equipment from service are provided.

Abstract: In a solid precursor evaporation system configured for use in a thin film deposition system, such as thermal chemical vapor deposition (TCVD), a method for preparing one or more trays of solid precursor is described. The solid precursor may be formed on a coating substrate, such as a tray, using one or more of dipping techniques, spin-on techniques, and sintering techniques.

Abstract: An arrangement for aligning a semiconductor process tool to a track system, and a method which facilitates the calibration and alignment between a previously installed overhead transport system in a fabrication facility or plant for semiconductor wafers or integrated circuit components, and a plurality of load ports on a process tool for the semiconductor wafer or integrated circuit components, which is to be subsequently installed in the fabrication facility.

Abstract: A vane type hydraulic energy translating device for pumping filtered seawater and which uses seawater as a lubricating fluid. The pump is a compact, light weight design in which the bearings and certain other critical components are fabricated from corrosion resistant, low friction, high strength materials. The vanes as well as flexible side plate members are formed of these corrosion resistant materials. The pump body is formed of high corrosion resistant stainless steel. The side plates are flexible and act as wear surfaces for the ends of the vanes as well as sealing surfaces about the rotor thereby preventing leakage of seawater from high to low pressure areas. Each vane is spring biased radially outward from the rotor axis with four springs disposed within apertures located in the vane base. The vanes are generally rectangular in shape and have an outer end portion which serves as a sliding seal against a cam ring track.

Abstract: A gland seal for a dynamoelectric machine which utilizes a passage through a ring member for conducting a relatively low pressure gas between a first axial face and a second axial face of the ring member. The seal also includes a relief portion in the first axial face whereby the ring member is forced against the high pressure side of the gland seal thereby diminishing the flow of oil to the high pressure side which is desirable in a hydrogen-cooled generator system.

Abstract: A hermetic refrigerant compressor having an electric motor and compressor assembly in a hermetic shell is cooled by oil which is first cooled in an external cooler 18 and is then delivered through the shell to the top of the motor rotor 24 where most of it is flung radially outwardly within the confined space provided by the cap 50 which channels the flow of most of the oil around the top of the stator 26 and then out to a multiplicity of holes 52 to flow down to the sump and provide further cooling of the motor and compressor. Part of the oil descends internally of the motor to the annular chamber 58 to provide oil cooling of the lower part of the motor, with this oil exiting through vent hole 62 also to the sump. Suction gas with entrained oil and liquid refrigerant therein is delivered to an oil separator 68 from which the suction gas passes by a confined path in pipe 66 to the suction plenum 64 and the separated oil drops from the separator to the sump.

Abstract: A heat pump is provided with an outdoor heat exchanger 30 having a main section 30a and a subcooling section 30b, with a circuiting arrangement and distribution and control means including expansion device 48, check valve 54 and lines 52, 56, 58 and 60 connected so that in a cooling mode of operation of the unit the refrigerant flows through the main section and then the subcooling section in series, and in a heating mode of operation the refrigerant flows only through the main section with the subcooling section receiving refrigerant for storage.

Abstract: The open-face frames of electric heat modules used with a pair of centrifugal fans in a roof top type air conditioning unit are mounted with their upwardly open faces spaced downwardly away from the downwardly facing discharge opening of the fans, rather than up tight against the discharge opening, so that there will be a bypass of at least some of the discharge air from the fan around the module to reduce the resistance to air flow imposed by the module. The arrangement achieves a good balance between the use of relatively high watt density heater while avoiding undue resistance to air flow through the heater. The invention also provides a convenient module mounting arrangement in which the inboard end walls of the modules are supported in a complementary hook and eye arrangement with mounting straps depending from the sides of the discharge openings of the centrifugal fans.

Abstract: A remote access manipulator comprises a locking mechanism capable of self-alignment for performing operations on equipment located in areas where human access is limited. The manipulator further comprises a slave carriage located in the equipment on which the operation is to be performed, such as a nuclear steam generator, for carrying tools and inspection devices for performing operations on the equipment together with a master carriage located in a scale model of the equipment and electrically connected to the slave carriage for controlling the movement of the slave carriage. The slave carriage is capable of advancing across a surface of the equipment to position the devices which it carries. The manipulator further comprises a slave manipulator arm used to move the slave carriage into and out of the equipment on which the operation is to be performed in conjunction with a master manipulator arm located in the scale model for controlling the movement of the slave manipulator arm.