Abstract: A printed circuit board may include a top side, a bottom side, and a circumferential surface that connects the top side to the bottom side. The circumferential surface may have a toothing for forming a gear wheel. The toothing may be circumferentially closed and may be arranged over an entire surface area of the circumferential surface. The toothing may be configured as an involute toothing, an epicycloid toothing, a hypocycloid toothing, or a lantern gear toothing. The printed circuit board may be formed of fiber-reinforced plastic. Further, the printed circuit board may include a track, a surface structure, and/or a conductor track configured for inductive sampling, capacitive sampling, optical sampling, and/or acoustic sampling.

Abstract: A current sensor system for measuring an AC electrical current, includes: an electrical conductor portion for conducting the AC current and generating a first magnetic field; a U-shaped magnetic shielding partially surrounding said electrical conductor portion, and having a central shielding portion and two shielding leg portions; a metal plate or a metal layer arranged at a distance from the shielding legs portions for allowing eddy currents to flow and for generating a second magnetic field; a magnetic sensor device arranged between the conductor portion and the metal plate or metal layer, and between the shielding leg portions, configured for measuring a magnetic field component. The sensor system likewise includes a three-phase current sensor system.

Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

Abstract: A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

Abstract: A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

Abstract: A visual implant (2) comprises an array of micro-electrodes (4) including at least two stimulation micro-electrodes each comprising: a core (106) of conducting material; insulating material (108) surrounding the core; and a layer (112) of metal or metal oxide nano-structures deposited on tips of the micro-electrodes at a front end for interfacing with a target site for visual stimulation; and an integrated circuit (6) to control a pattern of stimulation current driven through the array of micro-electrodes.

Abstract: A visual implant (2) comprises an array of micro-electrodes (4) including at least two stimulation micro-electrodes each comprising: a core (106) of conducting material; insulating material (108) surrounding the core; and a layer (112) of metal or metal oxide nano-structures deposited on tips of the micro-electrodes at a front end for interfacing with a target site for visual stimulation; and an integrated circuit (6) to control a pattern of stimulation current driven through the array of micro-electrodes.

Abstract: An auditory implant comprises an array of micro-electrodes including at least two stimulation micro-electrodes each comprising a core of conducting material; insulating material surrounding the core; and a layer of metal or metal oxide nano-structures deposited on tips of the micro-electrodes at a first end for interfacing with a target site for auditory stimulation; and an integrated circuit to control a pattern of stimulation current driven through the array of micro-electrodes.

Abstract: A multimodal needle comprises a plurality of micro-electrodes for electrochemical sensing. Each micro-electrode comprises a core of conducting material, insulating material surrounding the core, and a layer of metal or metal oxide nano-structures deposited on tips of the micro-electrodes at a first end for interfacing with a target sensing site. Such a multimodal needle is particularly useful for identifying tissue around the needle tip.

Abstract: An electrochemical probe comprises a wire bundle including two or more wire electrodes made of conducting material arranged alongside each other, and insulating material surrounding the electrodes. An impedance reducing layer of metal or metal oxide nano-structures is deposited on tips of the wire electrodes at a first end of the bundle. A functionalization layer is deposited on the impedance reducing layer at the first end of the bundle. Such a probe is particularly useful for electrochemical sensing applications such as neuronal scanning.

Abstract: A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

Abstract: A sensor device comprising a substrate, the substrate comprising one or more magnetic sensor elements; a first elastomeric material on top of the one or more magnetic sensor elements; a magnetic layer comprising a soft magnetic metal alloy deposited by electroplating or by sputtering on top of the first elastomeric material; and optionally a second elastomeric material on top of the magnetic layer. The substrate may be a CMOS device with IMC encapsulated between two polyimide layers. The magnetic material may be annealed at 250° C. to 295° C. using a constant or rotating magnetic field having a strength in the range from 100 to 300 mTesla. The soft magnetic alloy is arranged as Integrated Magnetic Concentrator (IMC).

Abstract: A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements. The magnetic sensor elements are arranged in the region of the edge of the magnetic field concentrator. No magnetic sensor element is present in the gaps.

Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

Abstract: A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements. The magnetic sensor elements are arranged in the region of the edge of the magnetic field concentrator. No magnetic sensor element is present in the gaps.

Abstract: A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Abstract: A one-dimensional magnetic field sensor comprises a support, a single elongated magnetic field concentrator or two magnetic field concentrators, which are separated by a first gap, and at least one magnetic sensor element. The magnetic field concentrator, or both thereof, consists of at least two parts which are separated from each other by second gaps. A two-dimensional magnetic field sensor comprises a support, a single magnetic field concentrator which consists of at least three parts which are separated from each other by gaps, and at least two magnetic sensor elements.

Abstract: A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Abstract: An electrochemical probe comprises a wire bundle including two or more wire electrodes made of conducting material arranged alongside each other, and insulating material surrounding the electrodes. An impedance reducing layer of metal or metal oxide nano-structures is deposited on tips of the wire electrodes at a first end of the bundle. A functionalization layer is deposited on the impedance reducing layer at the first end of the bundle. Such a probe is particularly useful for electrochemical sensing applications such as neuronal scanning.