Patents by Inventor Robert Ramsbottom

Robert Ramsbottom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250029793
    Abstract: A solid cathode electrolytic capacitor and method of making a solid electrolytic capacitor are provided. The capacitor comprises an anode comprising an anode lead and an anode lead extension extending from the anode lead. The anode lead and anode lead extension are joined at a weld region. A dielectric is on the anode and a cathode is on the dielectric.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 23, 2025
    Inventors: Brandon Summey, Jeff Poltorak, Robert Ramsbottom, Kevin Agosto
  • Publication number: 20240237220
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Application
    Filed: March 25, 2024
    Publication date: July 11, 2024
    Inventors: Brandon Summey, Peter Blais, Robert Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Patent number: 10522296
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: December 31, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Publication number: 20190139709
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Application
    Filed: January 2, 2019
    Publication date: May 9, 2019
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Patent number: 10204743
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: February 12, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Publication number: 20180226197
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 9, 2018
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Patent number: 9793058
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: October 17, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Patent number: 9748043
    Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: August 29, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Publication number: 20150348715
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Application
    Filed: May 20, 2015
    Publication date: December 3, 2015
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols
  • Publication number: 20130314845
    Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
    Type: Application
    Filed: August 6, 2013
    Publication date: November 28, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude