Abstract: The present invention relates to metabolites of [3-(4-{2-butyl-1-[4-(4-chloro-phenoxy)-phenyl]-1H-imidazol-4-yl}-phenoxy)-propyl]-diethyl-amine. These metabolites may act as RAGE antagonists. These metabolites may also be useful in assays to measure the presence or amount of one or more metabolites of the parent compound in a sample.

Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: Disclosed are compounds of Formula (I): or a salt thereof, wherein: X is CR6 or N; Y is CR3 or N; R1, R2, R3, R4, R5, R6, R7, and m are defined herein. Also disclosed are methods of using such compounds to inhibit the activity of one or both of diacylglycerol kinase alpha (DGK?) and diacylglycerol kinase zeta (DGK?), and pharmaceutical compositions comprising such compounds. These compounds are useful in the treatment of viral infections and proliferative disorders, such as cancer.

Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: Systems and processes for the treatment of a naphtha range hydrocarbon feedstock comprising sulfur-containing compounds, nitrogen-containing compounds, olefins, diolefins, and aromatics. The systems and processes are configured to treat the naphtha range hydrocarbon feedstock to convert the sulfur-containing compounds, nitrogen-containing compounds, and olefins, diolefins while less than 2 wt % aromatics are hydrogenated, producing an olefin lean overheads fraction comprising less than 0.2 wt % olefins and less than 100 mg/kg sulfur and an aromatics rich fraction comprising less than 50 ppmw olefins, less than 0.5 ppmw sulfur and less than 0.5 ppmw nitrogen.

Abstract: Disclosed is a fungicidal composition comprising (a) at least one compound selected from the compounds of Formula 1, including all geometric and stereoisomers, tautomers, A-oxides, and salts thereof, wherein E, L, J, A and T are as defined in the disclosure; and (b) at least one additional fungicidal compound. Also disclosed is a method for controlling plant diseases caused by fungal plant pathogens comprising applying to the plant or portion thereof, or to the plant seed, a fungicidally effective amount of a compound of Formula 1, an A-oxide, or salt thereof (e.g., as a component in the aforesaid composition). Also disclosed is a composition comprising: (a) at least one compound selected from the compounds of Formula 1 described above, A-oxides, and salts thereof; and at least one invertebrate pest control compound or agent.

Abstract: Concurrent servicing of a first cable of a cable pair while a second cable of the cable pair remains operational improves multi-processor computer system availability and serviceability. A pair of processing chips in different processing drawers may continue operation by way of the second cable while the first cable is degraded or serviced. Upon the servicing of the first cable, the serviced cable may transition to a fully operational state with no interruptions to the operations between the processing drawers by way of the second cable. Since cable faults are typically more common than processing chip or processing drawer faults, identification of cable faults and the ability to maintain operations of the processing drawers connected therewith is increasingly important.

Abstract: Systems, apparatuses, methods, and computer program products are disclosed for PQC. An example method includes transmitting a first portion of an electronic communication to a client device over a non-PQC communications channel, wherein the client device comprises a PQC shim circuitry. The example method further includes transmitting one or more communications between a PQC callback circuitry and the client device over a PQC communications channel, wherein the client device is a non-PQC device. The example method further includes transmitting a second portion of the electronic communication to the client device over a PQC communications channel.

Abstract: Disclosed is a fungicidal composition comprising (a) at least one compound selected from the compounds of Formula 1, including all geometric and stereoisomers, tautomers, N-oxides, and salts thereof, wherein R1, L and J are as defined in the disclosure and (b) at least one additional fungicidal compound. Also disclosed is a method for controlling plant diseases caused by fungal plant pathogens comprising applying to the plant or portion thereof, or to the plant seed, a fungicidally effective amount of a compound of Formula 1, an N-oxide, or salt thereof (e.g., as a component in the aforesaid composition). Also disclosed is a composition comprising: (a) at least one compound selected from the compounds of Formula 1 described above, N-oxides, and salts thereof; and at least one invertebrate pest control compound or agent.

Abstract: An aggregate representation of a collection of source code examples is constructed. The collection includes positive examples that conform to a coding practice and negative examples do not conform to the coding practice. The aggregate representation includes nodes corresponding to source code elements, and edges representing relationships between code elements. Using an iterative analysis of the aggregate representation, a rule to automatically detect non-conformance is generated. The rule is used to provide an indication that a set of source code is non-conformant.

Abstract: A technique employs a system and methodology for improving sand control in pumps. The technique may be used in centrifugal pumps by providing uniquely constructed rib feature to facilitate sand control and thus reduction of erosion due to sand in the pumped fluid. The improved sand control is useful in centrifugal pumps employed in a variety of oilfield applications, such as in electric submersible pumping systems positioned downhole in a wellbore to pump oil or other fluids. The rib feature may be used in combination with a shield and arranged along diffuser bowl walls or other diffuser walls within sequential pump stages.

Abstract: A technique employs a system and methodology for improving sand control in pumps. The technique may be used in centrifugal pumps by providing uniquely constructed rib feature to facilitate sand control and thus reduction of erosion due to sand in the pumped fluid. The improved sand control is useful in centrifugal pumps employed in a variety of oilfield applications, such as in electric submersible pumping systems positioned downhole in a wellbore to pump oil or other fluids. The rib feature may be used in combination with a shield and arranged along diffuser bowl walls or other diffuser walls within sequential pump stages.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A flat panel television mounting system is disclosed. The system includes an arm connected to a wall structure at a first end and to a flat panel television bracket at a second end. In one version, the arm may include two independent sections. One or more motors control the movements of the arm sections to move the flat panel television away from, or towards, a wall structure. Motors also control tilt and swivel functions. All flat panel television movements are controlled by a remote control device.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.