Patents by Inventor Robert Ray Voltenburg, Jr.

Robert Ray Voltenburg, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6421249
    Abstract: An electronic device having an enhanced attachment to a surface mount lamp (106) includes a circuit board (100), at least two conductive pads (102), at least two adhesive pads (104), and the surface mount lamp (106). The conductive pads (102) and the adhesive pads (104) are integrally formed within the circuit board (100). Preferably, each section of the circuit board (100) allotted for one surface mount lamp (106) has two conductive pads (102) and two adhesive pads arranged in a grid-like pattern such that similar pads are in opposing corners of the grid. The surface mount lamp (106) has two electrical leads (108), each protruding from opposing corners of a base (110) of the surface mount lamp (106). These electrical leads (108) are soldered to the conductive pads (102) in the circuit board (100). The unobscured opposing corners (112) of the plastic base (110) are partially melted and adhered to the adhesive pads (104) in the circuit board (100).
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: July 16, 2002
    Assignee: Delphi Technologies, Inc.
    Inventors: Donald Milton Trombley, Robert Ray Voltenburg, Jr., David Brian Houser, Paul Dennis Scheller
  • Patent number: 6081996
    Abstract: In a preferred embodiment, a through hole connector pin for a circular through hole defined through a printed circuit board substrate, including: a vertical cylindrical portion of the connector pin for insertion in the circular through hole, the vertical cylindrical portion having a diameter less than that of the circular through hole; and a horizontal offset head portion of the connector pin formed integrally with the vertical cylindrical portion, the horizontal offset head portion having a shape approximating that of a conductive pad disposed on an upper surface of the printed circuit board substrate.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: July 4, 2000
    Assignee: Delco Electronics Corporation
    Inventors: Victor David Kruppa, Maurice Lydell Dantzler, Robert Ray Voltenburg, Jr.