Patents by Inventor Robert RECHENBERG

Robert RECHENBERG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMPLANTABLE ALL DIAMOND MICROELECTRODE AND FABRICATION METHOD
    Publication number: 20200303236
    Abstract: An electrode is provided. The electrode includes a contact pad composed of boron-doped polycrystalline diamond (BDD); a fiber core composed of BDD extending longitudinally from the contact pad from a first end that is in direct contact with the contact pad to an opposing second end; and a polycrystalline diamond (PCD) cladding that coats and hermetically seals the contact pad and the fiber core. A first portion of the contact pad and a second portion at or near the second end of the fiber core are not coated and hermetically scaled by the PCD cladding. A method of fabricating the electrode is also provided.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 24, 2020
    Applicants: Board of Trustees of Michigan State University, Fraunhofer USA
    Inventors: Wen LI, Yue GUO, Thomas SCHUELKE, Michael BECKER, Robert RECHENBERG, Cory RUSINEK
  • Hybrid diamond-polymer thin film sensors and fabrication method
    Patent number: 10667709
    Abstract: An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 2, 2020
    Assignees: Board of Trustees of Michigan State University, Fraunhofer USA
    Inventors: Wen Li, Bin Fan, Robert Rechenberg, Michael Becker, Cory Rusinek
  • Hybrid Diamond-Polymer Thin Film Sensors And Fabrication Method
    Publication number: 20190282110
    Abstract: An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 19, 2019
    Applicants: Board of Trustees of Michigan State University, Fraunhofer USA
    Inventors: Wen LI, Bin FAN, Robert RECHENBERG, Michael BECKER, Cory RUSINEK