Abstract: The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.

Abstract: The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.

Abstract: The method of the present invention includes the steps of (a) optionally, applying a pretreatment composition to the substrate; (b) optionally, applying a conductive, weldable coating composition to the substrate; (c) optionally, coalescing the conductive, weldable coating composition to form a substantially continuous conductive coating; (d) applying a rinse composition to the substrate, the rinse composition including a surface energy modifying compound; (e) applying a powder coating composition to the rinse composition; (f) heating the powder coating composition to melt and level the powder coating composition to form a substantially continuous powder coating; (g) optionally, applying a clear coating composition over the powder coating; and (h) heating the substrate to coalesce and, optionally, crosslink the coating.