Patents by Inventor Robert Rosenburg

Robert Rosenburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7084479
    Abstract: In a multilevel microelectronic integrated circuit, air comprises permanent line level dielectric and ultra low-K materials are via level dielectric. The air is supplied to line level subsequent to removal of sacrificial material by clean thermal decomposition and assisted diffusion of byproducts through porosities in the IC structure. Optionally, air is also included within porosities in the via level dielectric. By incorporating air to the extent produced in the invention, intralevel and interlevel dielectric values are minimized.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: August 1, 2006
    Assignee: International Business Machines Corporation
    Inventors: Shyng-Tsong Chen, Stefanie Ruth Chiras, Matthew Earl Colburn, Timothy Joseph Dalton, Jeffrey Curtis Hedrick, Elbert Emin Huang, Kaushik Arun Kumar, Michael Wayne Lane, Kelly Malone, Chandrasekhar Narayan, Satyanarayana Venkata Nitta, Sampath Purushothaman, Robert Rosenburg, Christy Sensenich Tyberg, Roy RongQing Yu